C2220C104KCRACTU Kemet, C2220C104KCRACTU Datasheet - Page 6

• Manufacturer Part Number: C2220C104KCRACTU
• Description: CAP CER 0.1UF 500V X7R 2220
• Manufacturer: Kemet
• Series: C2220r

Specifications of C2220C104KCRACTU

• Capacitance: 0.1µF
• Voltage - Rated: 500V
• Tolerance: ±10%
• Temperature Coefficient: X7R
• Mounting Type: Surface Mount, MLCC
• Operating Temperature: -55°C ~ 125°C
• Features: High Voltage
• Applications: General Purpose
• Package / Case: 2220 (5750 Metric)
• Size / Dimension: 0.221" L x 0.197" W (5.60mm x 5.00mm)
• Thickness: 1.40mm
• Voltage Rating: 500 Volts
• Operating Temperature Range: - 55 C to + 125 C
• Temperature Coefficient / Code: X7R
• Product: General Type MLCCs
• Dimensions: 5 mm W x 5.6 mm L
• Termination Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Ratings: -
• Lead Spacing: -
• Lead Free Status / Rohs Status: Details
• Other names: C2220C104KCRAC; C2220C104KCRAC7800

Y
X
placement
courtyard
Grid
330mm (13.00")
178mm (7.00")
Tape & Reel Packaging
or
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, [phone]
Z
C
G
SURFACE MOUNT LAND DIMENSIONS - CERAMIC CHIP CAPACITORS - MM
Case Sizes 1210 are 12 mm tape with 8 mm pitch.
Case Sizes
Note: TU suffix represents tape and reel packaging of unmarked components.
CERAMIC CHIP CAPACITORS
TM suffix represents tape and reel packaging of marked components.
Calculation Formula
Z = Lmin + 2Jt + Tt
G = Smax - 2Jh -Th
X = Wmin + 2Js + Ts
Tt, Th, Ts = Combined tolerances
1210 are 8 mm tape with 4 mm pitch.
Dimension
0402
0603
0805
1206
1210
1812
1825
2220
2225
(.315 .012")
(.472 .012")
Packaging Information
12mm .30
8mm .30
or
available on punched paper only.
2.14
2.78
3.30
4.50
4.50
5.90
5.90
7.00
7.00
Anti-Static Reel
Z
0402 and 0603 case sizes
Embossed Carrier*
* Punched paper carrier used for 0402 and 0603 case size.
0.28
0.68
0.70
1.50
1.50
2.30
2.30
3.30
3.30
G
Reflow Solder
KEMET offers Multilayer Ceramic Chip Capacitors
packaged in 8mm and 12mm plastic tape on 7" and
13" reels in accordance with EIA standard 481-1:
Taping of surface mount components for automatic
handling. This packaging system is compatible with all
tape fed automatic pick and place systems. See page 78
and page 87 for MIL-PRF-55681 chips.
for details on reeling quantities for commercial chips
0.74
1.08
1.60
2.00
2.90
3.70
6.90
5.50
6.80
X
handling. This packaging system is compatible with all
tape fed automatic pick and place systems. See page 81
for details on reeling quantities for commercial chips
and page 90 for MIL-PRF-55681 chips.
Y(ref)
0.93
1.05
1.30
1.50
1.50
1.80
1.80
1.85
1.85
g
C(ref)
1.21
1.73
2.00
3.00
3.00
4.10
4.10
5.15
5.15
(except 1825 Commercial, and 1825 & 2225 Military)
Anti-Static Cover Tape
(.10mm (.004") Max Thickness)
Chip Orientation
in Pocket
3.18
3.70
4.90
4.90
Z
Embossment
0.68
0.70
1.50
1.50
G
Not Recommended
Not Recommended
Wave Solder
0.80
1.10
1.40
2.00
X
Y(ref)
1.25
1.50
1.70
1.70
Smin
1.93
2.20
3.20
3.20
93