SP1001-04XTG Littelfuse Inc, SP1001-04XTG Datasheet - Page 2

• Manufacturer Part Number: SP1001-04XTG
• Description: TVS ARRAY ESD SIL 4CH SOT553
• Manufacturer: Littelfuse Inc
• Series: SPA SP1001r

Specifications of SP1001-04XTG

• Package / Case: SOT-553-5
• Voltage - Reverse Standoff (typ): 5.5V
• Voltage - Breakdown: 6V
• Polarization: 4 Channel Array - Bidirectional
• Mounting Type: Surface Mount
• Clamping Voltage: 9.7 V (Typ)
• Operating Voltage: 5.5 V
• Peak Surge Current: 2 A
• Capacitance: 12 pF
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Dimensions: 1.3 (Max) mm W x 1.7 (Max) mm L x 0.6 (Max) mm H
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power (watts): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: F2896TR

CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress only rating and operation of the device
at these or any other conditions above those indicated in the operational sections of this
specification is not implied.
Notes:
1
2
SP1001 Series
A minimum of 1,000 ESD pulses are applied at 1s intervals between the anode and common cathode of each diode
Parameter is guaranteed by device characterization
Forward Voltage Drop
Reverse Voltage Drop
Reverse Standoff Voltage
Reverse Leakage Current
Clamp Voltage
Dynamic Resistance
ESD Withstand Voltage
Diode Capacitance
Absolute Maximum Ratings
Electrical Characteristics (T
Capacitance vs. Reverse Bias
Symbol
I
T
T
PP
OP
STOR
14
12
10
8
6
4
2
0
0
0.
Parameter
1
Peak Current (t
Operating Temperature
Storage Temperature
1
1
1.
1,2
Parameter
2
p
=8/20μs)
2.
DC Bias (V)
OP
= 25°C)
3
3.
Symbol
V
R
V
I
TVS Diode Arrays
General Purpose ESD Protection - SP1001 Series
LEAK
C
V
V
V
RWM
DYN
ESD
F
R
C
D
-60 to 150
4
-40 to 85
Value
2
4.
I
I
IEC61000-4-2 (Contact)
PP
PP
(V
Reverse Bias=2.5V
=1A, t
=2A, t
IEC61000-4-2 (Air)
Reverse Bias=0V
Reverse Bias=5V
Test Conditions
C2
- V
Units
I
.
I
F
I
R
V
C1
°C
°C
=10mA
p
p
R
A
=1mA
=8/20μs, Fwd
=8/20μs, Fwd
≤1μA
Revision: April 14, 2011
R
) / (I
=5V
6
PP2
22
- I
PP1
)
Thermal Information
Design Consideration
Because of the fast rise-time of the ESD transient,
placement of ESD devices is a key design consideration.
To achieve optimal ESD suppression, the devices should be
placed on the circuit board as close to the source of the ESD
transient as possible. Install the ESD suppressors directly
behind the connector so that they are the first board-level
circuit component encountered by the ESD transient. They
are connected from signal/data line to ground.
Storage Temperature Range
Maximum Junction Temperature
Maximum Lead Temperature (Soldering 10s)
(SPA
™
Min
±30
±15
0.7
7 .0
Family of Products)
Parameter
Please refer to
Typ
0.9
8.0
9.7
7 .8
1.7
12
8
7
Specifications are subject to change without notice.
www.littelfuse.com/SPA
Max
13.0
11.0
8.5
5.5
0.5
1.2
-65 to 150
Rating
150
260
for current information.
©2011 Littelfuse, Inc.
Units
μA
kV
kV
pF
pF
pF
Ω
V
V
V
V
V
Units
°C
°C
°C