ESDALC6V1-1U2 STMicroelectronics, ESDALC6V1-1U2 Datasheet
ESDALC6V1-1U2
Specifications of ESDALC6V1-1U2
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ESDALC6V1-1U2 Summary of contents
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... Cellular phone handsets and accessories January 2010 2 Figure 1. Description The ESDALC6V1-1U2 is a unidirectional single line TVS diode designed to protect data lines or other I/O ports against ESD transients. The device is ideal for applications where both reduced line capacitance and board space saving are required ...
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... Symbol Test conditions Square pulse T ° amb MHz, V line R osc 2/ °C) amb Parameter ( initial °C) amb = 2.5 µs p (25 ° osc Doc ID 15089 Rev 2 ESDALC6V1-1U2 Value ± amb +150 260 -40 to +125 Slope = 1 Min Typ Max 6 100 - 1 4.5 - 12.0 - Unit kV ...
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... ESDALC6V1-1U2 Figure 3. Relative variation of peak pulse power versus initial junction temperature 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 T (°C) 0 Figure 5. Clamping voltage versus peak pulse current (square pulse, typical values 2.5 µs T initial =25 °C j 1.0 ...
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... GHz 538 MHz < -5.2 dB < -2.1dB Attenuation Attenuation (-6.1dB@900 MHz (-2.5dB@900MHz (0.8 – 4GHz) (0.8 – 4GHz) -14 dB@1.8 GHz) -6.1dB@1.8GHz) 100.0k 1.0M 10.0M 100.0M Doc ID 15089 Rev 2 ESDALC6V1-1U2 ESD response to IEC 61000-4-2 (-8 kV contact discharge) 20 ns/Div F (Hz) 1.0G ...
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... ESDALC6V1-1U2 2 Ordering information scheme Figure 11. Ordering information scheme ESD Array Low capacitance Breakdown Voltage 6V1 = 6.1 V min Package U2 = ST0201 Doc ID 15089 Rev 2 Ordering information scheme ESDA LC 6V1 - 1U2 5/11 ...
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... D E Top Side Bottom e Figure 13. Marking 0.30 Doc ID 15089 Rev 2 ESDALC6V1-1U2 Dimensions Ref Millimetres Inches Min Typ Max Min A 0.23 0.28 0.33 0.009 0.011 0.013 b1 0.13 0.18 0.23 0.005 0.007 0.009 b2 0.14 0.19 0.24 0.006 0.007 0.009 D 0 ...
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... ESDALC6V1-1U2 Figure 14. Tape and reel specifications 0.20 ± 0.05 0.34 ± 0.03 All dimensions in mm Bar indicates Pin 1 2.0 ± 0.05 4.0 ± 0.1 0.37 +0.03, -0.02 User direction of unreeling Doc ID 15089 Rev 2 Package information Ø 1.55 ± 0.05 2.0 ± 0.1 ...
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... Offers a high tack force to resist component movement during high speed 4. Solder paste with fine particles: powder particle size is 20-45 µm. 8/11 1.05 0.425 0.425 0.225 0.040 0.065 0.20 Stencil window Footprint Doc ID 15089 Rev 2 ESDALC6V1-1U2 0.30 0.038 0.320 0.038 ...
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... ESDALC6V1-1U2 4.3 Placement 1. Manual positioning is not recommended recommended to use the lead recognition capabilities of the placement system, not the outline centering 3. Standard tolerance of ± 0. recommended. 4. 3.5 N placement force is recommended. Too much placement force can lead to squeezed out solder paste and cause solder joints to short. Too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages ...
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... The marking can be rotated by 90° to diferentiate assembly location 6 Revision history Table 5. Document revision history Date 07-Oct-2008 25-Jan-2010 10/11 Marking Weight (1) L1 0.124 mg Revision 1 Initial release. 2 Updated base qty inTable 4. Doc ID 15089 Rev 2 ESDALC6V1-1U2 Base qty Delivery mode 15000 Tape and reel Changes ...
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... ESDALC6V1-1U2 Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ...