DSILC6-4P6 STMicroelectronics, DSILC6-4P6 Datasheet
DSILC6-4P6
Specifications of DSILC6-4P6
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DSILC6-4P6 Summary of contents
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... DSILC6-4P6 Functional diagram I/O4 VCC I/O3 I/O2 GND I/O1 SOT-666 Top-side view Order Code Part Number DSILC6-4P6 DSILC6-4F2 Complies with the following standards: IEC 61000-4-2 level (contact discharge (air discharge) MIL STD 883G-Method 3015-7: class 3B Rev 3 DSILC6-4xx I/O2 Flip-Chip DSILC6-4F2 I/O1 ...
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... V, I MHz 400 mV OSC MHz I/O OSC 4 MHz 400 mV OSC MHz I/O OSC MHz I/O OSC DSILC6-4xx Value 8 15 SOT-666 5 Flip-Chip 7 SOT-666 90 Flip-Chip 120 -55 to +150 125 260 Value Min Typ Max 0 SOT-666 2 2.5 Flip-Chip 2.5 3 SOT-666 1.5 1 ...
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... T (° Figure 3. Remaining voltage after DSILC6-4P6 during ESD 15 kV positive surge (air discharge) 50 ns/div Figure 5. Remaining voltage after DSILC6-4P6 during ESD 15 kV negative surge (air discharge) 50 ns/div Figure 2. Relative variation of leakage current versus junction temperature Flip-Chip (typical values 100 ...
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... Frequency responses of all lines DSILC6-4P6 S21(dB) 0.00 - 5.00 - 10.00 - 15.00 F(Hz) - 20.00 100.0k 1.0M 10.0M Line 1 Line 3 Figure 9. Crosstalk results for lines 1/2 and 1/3 DSILC6-4P6 S21(dB) 0.00 - 20.00 - 40.00 - 60.00 - 80.00 - 100.00 - 120.00 F(Hz) - 140.00 100.0k 1.0M 10.0M Xtalk 1/2 4/11 Figure 8 ...
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... Hinge Analog Earpiece Audio Power DSILC6-4xx MDDI Data (Host) MDDI Strobe (Host) GND DATA1+ DATA1- CLOCK+ CLOCK- SMIA device SCL SDA Application examples Upper Clamshell MDDI Client PRIMARY & LCD LCD Controller Chip (With Frame Buffer) SECONDARY LCD DSILC6-4xx ESDALC6V1P3 5/11 ...
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... V BUS V BUS + + + GND GND R S USBLC6-2P6 + Open Closed Closed Open Closed then open Open BI_DA+ BI_DA- BI_DB+ BI_DB- DATA TRANSCEIVER BI_DC+ BI_DC- BI_DD+ BI_DD HUB- DOWNSTREAM Protecting TRANSCEIVER Bus Switch V BUS + R X LS/ LS/ GND LS/ LS/ LS/ LS/ GND DSILC6-4xx X LS/ LS/ DSILC6-4xx ...
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... DSILC6-4xx 3 Ordering information scheme Product Designation Low capacitance Breakdown Voltage Volts Number of lines protected lines Packages P6 = SOT-666 F2 = Flip-Chip Ordering information scheme DSI 7/11 ...
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... D 1.50 1.70 0.059 E 1.50 1.70 0.059 E1 1.10 1.30 0.043 e 0.50 L1 0.19 L2 0.10 0.30 0.004 L3 0.10 G DSILC6-4xx Inches Typ. Max. 0.024 0.007 0.013 0.067 0.067 0.051 0.020 0.007 0.012 0.004 ...
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... DSILC6-4xx Figure 13. Flip-Chip Dimensions Figure 14. Flip-Chip footprint Copper pad Diameter : 220µm recommended Solder stencil opening : 330µm recommended Solder mask opening recommendation : 300µm recommended Figure 16. Flip-Chip tape and reel specifications All dimensions order to meet environmental requirements, ST offers these devices in ECOPACK® ...
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... Ordering information 5 Ordering information Ordering code DSILC6-4P6 DSILC6-4F2 6 Revision history Date 10-Aug-2006 04-Jan-2007 28-May-2007 10/11 Marking Package G SOT-666 EI Flip-Chip 2.22 mg Revision Description of Changes 1 Initial release. Added Flip-Chip package. Added applications examples for 2 SMIA, Ethernet 1 Gb, and USB. Updated Tj max to 150. Added V line in Table 2 ...
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... DSILC6-4xx Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ...