ESDALC6V1-5T6 STMicroelectronics, ESDALC6V1-5T6 Datasheet - Page 7

• Manufacturer Part Number: ESDALC6V1-5T6
• Description: TRANSIL ARRAY LOW CAP ESD UDFN
• Manufacturer: STMicroelectronics

Specifications of ESDALC6V1-5T6

• Voltage - Reverse Standoff (typ): 3V
• Voltage - Breakdown: 6.1V
• Power (watts): 25W
• Polarization: 5 Channel Array - Unidirectional
• Mounting Type: Surface Mount
• Package / Case: 6-µDFN
• Polarity: Unidirectional
• Channels: 5 Channels
• Operating Voltage: 3 V
• Breakdown Voltage: 6.1 V
• Termination Style: SMD/SMT
• Peak Surge Current: 2 A
• Peak Pulse Power Dissipation: 25 W
• Capacitance: 7 pF
• Dimensions: 1 mm W x 1 mm L x 0.4 mm H
• Suppressor Type: Diode Arrays
• Esd Protection Voltage: 8KV@HBM/15KV@Air Gap/8KV@Contact Disc
• Direction Type: Uni-Directional
• Configuration: Quint
• Mounting Style: Surface Mount
• Leakage Current (max): 0.1uA
• Capacitance Value: 9pF
• Operating Temperature Min Deg. C: -55C
• Operating Temperature Max Deg. C: 125C
• Product Length (mm): 1mm
• Product Depth (mm): 1mm
• Product Height (mm): 0.35mm
• Pin Count: 6
• Rad Hardened: No
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 497-10291-2

ESDALC6V1-5T6
4
4.1
Recommendation on PCB assembly
Stencil opening design
1.
Figure 17. Stencil opening dimensions
2.
Figure 18. Recommended stencil window position
General recommendation on stencil opening design
a)
b)
Reference design
a)
b)
Stencil opening dimensions: L (Length), W (Width), T (Thickness).
General design rule
Stencil thickness (T) = 75 ~ 125 µm
Stencil opening thickness: 100 µm
Stencil opening for leads: Opening to footprint ratio is 100%.
Aspect Ratio
Aspect Area
175 µm
150 µm
=
=
W
---- -
--------------------------- -
2T L
T
Doc ID 16741 Rev 2
L
≥
(
×
1.5
+
W
W
)
≥
0.66
L
175 µm
T
W
Recommendation on PCB assembly
T=100 µm and opening
ratio is 100%
1.280
Footprint
0.520
0.560
0.175
Stencil window
Footprint
0.375
0.150
0.900
0.200
0.175
0.240
0.520
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