NUP1301ML3T1G ON Semiconductor, NUP1301ML3T1G Datasheet
![IC DIODE ARRAY LOCAP ESD SOT-23](/photos/1/38/13877/sot-23-3_to-236-3_micro3_ssd3_sst3_sml.jpg)
NUP1301ML3T1G
Specifications of NUP1301ML3T1G
NUP1301ML3T1GOSTR
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NUP1301ML3T1G Summary of contents
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... ORDERING INFORMATION Device Package Shipping NUP1301ML3T1 SOT−23 3000 / Tape & Reel NUP1301ML3T1G SOT−23 3000 / Tape & Reel (Pb−Free) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. ...
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THERMAL CHARACTERISTICS Characteristic Thermal Resistance Junction−to−Ambient Lead Solder Temperature Maximum 10 Seconds Duration Junction Temperature Storage Temperature ELECTRICAL CHARACTERISTICS Characteristic OFF CHARACTERISTICS = 100 mA) Reverse Breakdown Voltage (I (BR) Reverse Voltage Leakage Current Diode Capacitance (between I/O and ground) ...
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ESD Input Signal Electrostatic Discharge A common means of protecting high−speed data lines is to employ low−capacitance diode arrays in a rail−to−rail configuration. Two devices per line are connected between two fixed voltage references such the transient ...
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... *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. MicroIntegration is a trademark of Semiconductor Components Industries, LLC (SCILLC). ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein ...