DF3A6.8FUT1G ON Semiconductor, DF3A6.8FUT1G Datasheet

DF3A6.8FUT1G

Manufacturer Part Number

DF3A6.8FUT1G

Description

TVS ZENER DUAL CA 20W SOT323

Manufacturer

ON Semiconductor

Datasheet

1.DF3A6.8FUT1G.pdf (4 pages)

Specifications of DF3A6.8FUT1G

Voltage - Reverse Standoff (typ)

Voltage - Breakdown

6.4V

Power (watts)

20W

Polarization

2 Channel Array - Unidirectional

Mounting Type

Surface Mount

Package / Case

SC-70-3, SOT-323-3

Number Of Elements

Dual Common Anode

Package Type

SOT-323

Zener Voltage (typ)

6.4V

Zener Test Current

5mA

Power Dissipation

200mW

Knee Impedance

50Ohm

Operating Temperature Classification

Military

Rev Curr

500nA

Mounting

Surface Mount

Pin Count

Operating Temp Range

-55C to 150C

Polarity

Unidirectional

Channels

2 Channels

Clamping Voltage

16 V

Operating Voltage

5 V

Breakdown Voltage

6.4 V

Termination Style

SMD/SMT

Peak Surge Current

9.37 A

Peak Pulse Power Dissipation

150 W

Maximum Operating Temperature

+ 150 C

Minimum Operating Temperature

- 55 C

Dimensions

1.24 mm W x 2.1 mm L

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Other names

DF3A6.8FUT1GOSTR

Available stocks

Company

Part Number

Manufacturer

Quantity

Price

Company:

Bonase Electronics (HK) Co., Limited

Part Number:

DF3A6.8FUT1G

Manufacturer:

ON Semiconductor

Quantity:

319 765

Company:

Bonase Electronics (HK) Co., Limited

Part Number:

DF3A6.8FUT1G

Manufacturer:

Quantity:

30 000

Company:

Bonase Electronics (HK) Co., Limited

Part Number:

DF3A6.8FUT1G

Manufacturer:

Quantity:

30 000

Company:

H&T Electronics

Part Number:

DF3A6.8FUT1G

Quantity:

9 000

Company:

H&T Electronics

Part Number:

DF3A6.8FUT1G

Quantity:

320

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DF3A6.8FUT1

Zener Transient Voltage

Suppressor

Dual Common Anode Zeners for ESD

Protection

applications requiring transient overvoltage protection capability. They

are intended for use in voltage and ESD sensitive equipment such as

computers, printers, business machines, communication systems,

medical equipment and other applications. Their dual junction common

anode design protects two separate lines using only one package. These

devices are ideal for situations where board space is at a premium.

Features

Mechanical Characteristics

1. Mounted on FR−5 Board = 1.0 X 0.75 X 0.062 in.

2. Non−repetitive pulse per Figure 1.

3. Non−repetitive pulse per Figure 2.

July, 2004 − Rev. 1

MAXIMUM RATINGS

Maximum ratings are those values beyond which device damage can occur.

Maximum ratings applied to the device are individual stress limit values (not

normal operating conditions) and are not valid simultaneously. If these limits

are exceeded, device functional operation is not implied, damage may occur

and reliability may be affected.

Steady State Power Dissipation

Thermal Resistance Junction−to−Ambient

Operating Junction and Storage

Peak Power Dissipation @ 1.0 ms

Peak Power Dissipation @ 20 ms (Note 3)

ESD Discharge

These dual monolithic silicon zener diodes are designed for

Pb−Free Package is Available

SC−70 Package Allows Two Separate Unidirectional Configurations

Low Leakage < 1.0 mA @ 5.0 V

Breakdown Voltage: 6.4−7.2 V @ 5.0 mA

ESD Protection Meeting:16 kV Human Body Model

Peak Power: 24 W @ 1.0 ms (Unidirectional), per Figure 1

Peak Power: 150 W @ 20 ms (Unidirectional), per Figure 2

Void Free, Transfer−Molded, Thermosetting Plastic Case

Corrosion Resistant Finish, Easily Solderable

Package Designed for Optimal Automated Board Assembly

Small Package Size for High Density Applications

Semiconductor Components Industries, LLC, 2004

Derate above 25 C (Note 1)

Temperature Range

(Note 2) @ T

@ T

MIL STD 883C − Method 3015−6

IEC61000−4−2, Air Discharge

IEC61000−4−2, Contact Discharge

= 25 C

Rating

Preferred Device

30 kV Contact = IEC61000−4−2

Symbol

, T

qJA

stg

− 55 to

Value

+150

200

618

150

1.6

mW/ C

Unit

C/W

†For information on tape and reel specifications,

Preferred devices are recommended choices for future use

and best overall value.

DF3A6.8FUT1

DF3A6.8FUT1G

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specifications

Brochure, BRD8011/D.

SC−70/SOT−323

Device

CASE 419

STYLE 4

ORDERING INFORMATION

http://onsemi.com

(Pb−Free)

Package

SC−70

Publication Order Number:

= Specific Device Code

= Date Code

3000/Tape & Reel

MARKING

DIAGRAM

3000/Tape & Reel

DF3A6.8FUT1/D

Shipping

†

Related parts for DF3A6.8FUT1G

DF3A6.8FUT1G Summary of contents

Page 1

... Mounted on FR−5 Board = 1.0 X 0.75 X 0.062 in. 2. Non−repetitive pulse per Figure 1. 3. Non−repetitive pulse per Figure 2. Semiconductor Components Industries, LLC, 2004 July, 2004 − Rev. 1 DF3A6.8FUT1 DF3A6.8FUT1G †For information on tape and reel specifications, including part orientation and tape sizes, please Symbol Value Unit refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D ...

Page 2

ELECTRICAL CHARACTERISTICS ( unless otherwise noted) A UNIDIRECTIONAL (Circuit tied to Pins 1 and and 3) Symbol Parameter V Working Peak Reverse Voltage RWM I Maximum Reverse Leakage Current @ Breakdown ...

Page 3

PULSE WIDTH (t DEFINED AS THAT POINT t r WHERE THE PEAK PEAK VALUE — I CURRENT DECAYS TO 100 RSM 50% HALF VALUE — ...

Page 4

... H *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein ...

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