02013J0R2PBWTR\500 AVX Corporation, 02013J0R2PBWTR\500 Datasheet - Page 18
![CAP ACCU-P CHIP 25V 0.2PF 0201](/photos/1/11/11142/accu-p_0201_sml.jpg)
02013J0R2PBWTR\500
Manufacturer Part Number
02013J0R2PBWTR\500
Description
CAP ACCU-P CHIP 25V 0.2PF 0201
Manufacturer
AVX Corporation
Series
Accu-P®r
Datasheet
1.0201YJ2R8BBWTR500.pdf
(20 pages)
Specifications of 02013J0R2PBWTR\500
Features
RF, High Q, Low Loss
Package / Case
0201 (0603 Metric)
Tolerance
±0.02pF
Capacitance
0.20pF
Voltage - Rated
25V
Mounting Type
Surface Mount
Height
0.011" (0.28mm)
Operating Temperature
-55°C ~ 125°C
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
1
Accu-F
Application Notes
GENERAL
Accu-F
soldering to printed circuit boards or other substrates. The
construction of the components is such that they will with-
stand the time/temperature profiles used in both wave and
reflow soldering methods.
CIRCUIT BOARD TYPE
The circuit board types which may be used with Accu-F
Accu-P
For other circuit board materials, please consult factory.
WAVE SOLDERING
DIMENSIONS:
REFLOW SOLDERING
DIMENSIONS:
22
(0.042)
1.06
Accu-F
Accu-P
(0.030)
0.78
(0.016)
Accu-P
0.40
(0.010)
0201
(0.016)
0.26
0.40
Accu-P
(0.010)
0.26
0201
®
®
®
®
are as follows:
and Accu-P
: All flexible types of circuit boards
: All flexible types of circuit boards
®
(eg. FR-4, G-10).
(eg. FR-4, G-10) and also alumina.
(0.010)
®
0.26
(0.013)
0.34
(0.010)
0.26
(0.013)
0.34
®
millimeters (inches)
millimeters (inches)
(0.083)
®
2.1
(0.068)
Accu-P
/ Accu-P
1.7
SMD capacitors are designed for
(0.031)
(0.031)
0.8
0402
0.8
Accu-P
(0.020)
(0.024)
(0.024)
0402
0.5
0.6
0.6
(0.022)
(0.020)
0.55
0.5
®
(0.022)
0.55
®
(0.091)
(0.122)
2.3
3.1
Accu-F
(0.047)
(0.047)
Accu-F
0603
1.2
1.2
(0.031)
(0.028)
(0.031)
0603
0.8
(0.028)
0.7
0.8
0.7
(0.031)
®
(0.031)
0.8
®
0.8
®
®
and
(0.122)
(0.091)
2.3
3.1
Accu-P
(0.049)
(0.049)
1.25
1.25
Accu-P
0603
(0.033)
(0.024)
(0.033)
0.85
0.85
0603
0.6
(0.024)
HANDLING
SMD capacitors should be handled with care to avoid damage
or contamination from perspiration and skin oils. The use of
plastic tipped tweezers or vacuum pick-ups is strongly recom-
mended for individual components. Bulk handling should
ensure that abrasion and mechanical shock are minimized. For
automatic equipment, taped and reeled product gives the
ideal medium for direct presentation to the placement
machine.
COMPONENT PAD DESIGN
Component pads must be designed to achieve good
joints and minimize component movement during reflow
soldering. Pad designs are given below for both wave and
reflow soldering.
The basis of these designs is:
0.6
(0.031)
(0.031)
a. Pad width equal to component width. It is permissible to
b. Pad overlap 0.5mm beneath large components. Pad
c. Pad extension of 0.5mm for reflow of large components
0.8
0.8
®
®
decrease this to as low as 85% of component width but
it is not advisable to go below this.
and pad extension about 0.3mm for reflow of small com-
ponents. Pad extension about 1.0mm for wave soldering.
overlap about 0.3mm beneath small components.
(0.157)
(0.118)
4.0
3.0
(0.039)
(0.039)
(0.039)
(0.059)
(0.039)
(0.059)
1.0
1.0
1.0
1.5
1.0
1.5
Accu-F
Accu-P
0805
Accu-F
Accu-P
0805
(0.049)
1.25
(0.049)
®
®
1.25
®
®
(0.197)
(0.157)
5.0
4.0
(0.059)
(0.079)
(0.059)
(0.039)
(0.079)
(0.039)
1.5
1.5
2.0
1.0
2.0
1.0
Accu-P
1210
Accu-P
1210
(0.098)
2.5
®
(0.098)
2.5
®