SF-0402S200-2 Bourns Inc., SF-0402S200-2 Datasheet - Page 2

• Manufacturer Part Number: SF-0402S200-2
• Description: FUSE 2.0A SLOW SMD 0402
• Manufacturer: Bourns Inc.
• Series: SinglFuse™ SFr
• Type: Slow Blowr

Specifications of SF-0402S200-2

• Fuse Type: Slow Blow, Time Lag
• Voltage - Rated: 24VDC
• Current: 2A
• Package / Case: 0402 (1005 Metric)
• Size / Dimension: 0.040" L x 0.020" W x 0.014" H (1.00mm x 0.50mm x 0.35mm)
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 105°C
• Dc Cold Resistance: 0.024 Ohm
• Melting I²t: 0.0404
• Current Rating: 2 Amps
• Voltage Rating: 24 Volts
• Fuse Size / Group: 0402
• Termination Style: SMD/SMT
• Body Material: Ceramic
• Dimensions: 1 mm L x 0.52 mm W
• Product: Surface Mount Fuse
• Interrupt Rating: 35 Amps
• Mounting Style: SMD/SMT
• Operating Temperature Range: - 20 C to + 120 C
• Resistance: 24 mOhms
• Voltage Rating Vdc: 24V
• Fuse Current: 2A
• Breaking Capacity: 35A @ 24VDC
• Blow Characteristic: Slow Blow
• Fuse Case Style: 402
• Svhc: No SVHC (15-Dec-2010)
• Approval Category: UL Recognised
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Color: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: SF-0402S200-2TR

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SinglFuse
PACKAGING: 10,000 pcs./reel
Operating Temperature ................................................................................. -40 °C to +105 °C
Storage Conditions
Solder Refl ow Recommendations
Product Dimensions
Thermal Derating Curve
Portable memory
LCD monitors
Disk drives
PDAs
Digital cameras
DVDs
Temperature ............................................................................................... +5 °C to +35 °C
Humidity .........................................................................................................40 % to 75 %
Shelf Life ...........................................................................2 years from manufacturing date
250
200
150
100
SF-0402S Series - Slow Blow Surface Mount Fuses
50
(.008 ± .004)
0.2 ± 0.1
™
(.039 ± .004)
SF-0402S Series Applications
120
110
100
1.0 ± 0.1
90
80
-20
(.008 ± .004)
180 °C
150 °C
0.2 ± 0.1
0
AMBIENT TEMPERATURE (°C)
20
(.020 ± .002)
PRE-HEATING ZONE
0.52 ± 0.05
90 ± 30 Seconds
HEATING TIME
Peak: 250 +0/-5 °C
40
230 °C or higher
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Cell phones
Rechargeable battery packs
Battery chargers
Set top boxes
Industrial controllers
30 ± 10 Seconds
60
DIMENSIONS:
(.010 ± .004)
0.25 ± 0.1
80
SOLDERING ZONE
100
(.010 ± .004)
0.25 ± 0.1
(INCHES)
MM
(.014 ± .002)
120
0.35 ± 0.05
Customers should verify actual device performance in their specifi c applications.
PEAK: 250 +0/-5 °C, 5 seconds
PRE-HEATING ZONE: 150 to 180 °C, 90 ± 30 seconds
SOLDERING ZONE: 230 °C or higher, 30 ± 10 seconds
Sn PLATING
Recommended Pad Layout
Construction & Material Content
Specifi cations are subject to change without notice.
CERAMIC SUBSTRATE
(.015)
0.381
(.061)
1.55
FUSE ELEMENT
OVERCOAT
Cu / Ni PLATING
(.022)
0.558