FP1109-1R0-R Coiltronics/Div of Cooper/Bussmann, FP1109-1R0-R Datasheet
FP1109-1R0-R
Specifications of FP1109-1R0-R
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FP1109-1R0-R Summary of contents
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... FP1109-R47-R 463 FP1109-R58-R 548 FP1109-1R0-R 950 1 Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.10V rms , 0.0Adc 2 Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1V rms , I sat rms : DC current for an approximate temperature rise of 40°C without core loss. Derating is necessary for AC currents. PCB pad layout, trace thickness and width, air-flow and proximity of other heat generating components will affect the temperature rise recommended the part temperature not exceed 125° ...
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... F ront V iew 9 4.10 ref 2.03 ref (2X ) xxx = Inductance value in μ Decimal point “R” is present, then last character zeros Part Marking: FP1109 Packaging Information - mm 1.5 dia. +0.1/-0.0 Section A-A 17.5 11.4 9.3 Supplied in tape-and-reel packaging, 350 parts per reel, 13” diameter reel. ...
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Core Loss Inductance Characteristics 120% 100% 80% 60% 40% 20 ...
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Solder Reflow Profile T P Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C Preheat A T smax T smin t s 25°C Time 25°C to Peak Reference JDEC J-STD-020D Profile Feature Preheat and Soak ...