CM453232-R47ML Bourns Inc., CM453232-R47ML Datasheet - Page 2

• Manufacturer Part Number: CM453232-R47ML
• Description: INDUCTOR CHIP .47UH 20% 4523 SMD
• Manufacturer: Bourns Inc.
• Series: CM453232r
• Type: Ferrite Corer

Specifications of CM453232-R47ML

• Inductance: 470nH
• Current: 545mA
• Tolerance: ±20%
• Dc Resistance (dcr): 320 mOhm Max
• Q @ Freq: 40 @ 25.2MHz
• Self Resonant Freq: 145MHz
• Package / Case: 1812 (4532 Metric)
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C
• Frequency - Test: 25.2MHz
• Material - Core: Ferrite
• Applications: Mobile Communications
• Inductance Tolerance: ± 20%
• Dc Resistance Max: 0.32ohm
• Dc Current Rating: 545mA
• Resonant Frequency: 145MHz
• Q @ Vr F: 40
• Core Material: Ferrite
• Inductor Case Style: 1812
• No. Of Pins: 2
• Svhc: No SVHC (15-Dec-2010)
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Shielding: -
• Current - Saturation: -
• Current - Temperature Rise: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

CM10, CM16, CM20, CM25, CM32
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
Model
t1
Packaging Specifications
CM10
CM16
CM20
CM25
CM32
CM45
Reel Dimensions
Packaging
Soldering
Flow Soldering
Model
CM10
CM16
CM20
Model
CM10
CM16
CM20
CM25
CM32
CM45
Flow Soldering
t2
Vapor-phase
Infrared
CM45, CM32, CM25, CM20, CM16, CM10 SMT Chip Inductors
0.71 (.027) 1.21 (.047) 8.00 (.315) 3.50 (.138) 1.75 (.069) 4.00 (.157) 2.00 (.079) 4.00 (.157) 1.50 (.059) 0.60 (.024) 0.27 (.011) 1.20 (.047)
1.00 (.039) 1.80 (.071) 8.00 (.315) 3.50 (.138) 1.75 (.069) 4.00 (.157) 2.00 (.079) 4.00 (.157) 1.50 (.059) 0.60 (.024) 0.27 (.011) 1.20 (.047)
1.45 (.057) 2.25 (.089) 8.00 (.315) 3.50 (.138) 1.75 (.069) 4.00 (.157) 2.00 (.079) 4.00 (.157) 1.50 (.059) 1.00 (.039) 0.25 (.010) 1.55 (.061)
2.40 (.094) 2.90 (.114) 8.00 (.315) 3.50 (.138) 1.75 (.069) 4.00 (.157) 2.00 (.079) 4.00 (.157) 1.50 (.059) 1.10 (.043) 0.25 (.010) 1.85 (.073)
2.80 (.110) 3.60 (.142) 8.00 (.315) 3.50 (.138) 1.75 (.069) 4.00 (.157) 2.00 (.079) 4.00 (.157) 1.50 (.059)
3.60 (.142) 4.90 (.193) 12.00 (.472) 5.50 (.217) 1.75 (.069) 8.00 (.315) 2.00 (.079) 4.00 (.157) 1.50 (.059)
Preheat:
100 to 150 °C
2 minutes
min.
W
Chip
Component
A
E
10000 pcs
178 (7.008) 60 min. 13 (.512)
178 (7.008) 60 min. 13 (.512)
178 (7.008) 60 min. 13 (.512)
178 (7.008) 60 min. 13 (.512)
178 (7.008) 60 min. 13 (.512)
178 (7.008) 60 min. 13 (.512)
3000 pcs
3000 pcs
Quantity
F
A
10 seconds max.
260 °C maximum for 5 seconds (2 wave solder method)
200 °C for a maximum of 30 seconds. Peak of 240 °C for a maximum of 5 seconds.
If the solder does not reflow simultaneously under each terminal, there may be a misalignment of the component on the
board. For this reason, it is recommended that the inductor be adhered to the board prior to reflow.
215 °C for a maximum of 30 seconds.
B
ØDo
260 °C
DIA.
D1
P1
B
Weight
150 g
90 g
90 g
W
P2
Tape running direction
C
P3
F
21 (.827)
21 (.827)
21 (.827)
21 (.827)
21 (.827)
21 (.827)
A
Infrared Soldering
D
Model
CM25
CM32
CM45
E
Preheat:
100 to 150 °C
2 minutes
min.
B
2 (.079)
2 (.079)
2 (.079)
2 (.079)
2 (.079)
2 (.079) 13 (.512)
E
Quantity
2000 pcs
2000 pcs
500 pcs
10 seconds max.
30 seconds max.
P1
9 (.354)
9 (.354)
9 (.354)
9 (.354)
9 (.354)
W
230 °C
200 °C
CM45
P2
t1
Weight
100 g
190 g
100 g
t2
P3
Chip
Component
W
E
F
¿D0
Vapor-phase Soldering
A
ØDo
Preheat:
100 to 150 °C
2 minutes
min.
P1
¿D1
—
—
10 seconds max.
30 seconds max.
P2
Tape running direction
E
0.25 (.010) 2.40 (.094)
0.30 (.012) 3.50 (.138)
P3
220 °C
C
t1
D
215 °C
A
t2
B
W
B