FP1206R1-R40-R Coiltronics/Div of Cooper/Bussmann, FP1206R1-R40-R Datasheet

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FP1206R1-R40-R

Manufacturer Part Number
FP1206R1-R40-R
Description
INDUCTOR HIGH CURRENT 400NH SMD
Manufacturer
Coiltronics/Div of Cooper/Bussmann
Series
FLAT-PAC™, FP1206r
Type
Ferrite Corer
Datasheet

Specifications of FP1206R1-R40-R

Inductance
400nH
Current
50A
Current - Saturation
24A
Tolerance
±10%
Dc Resistance (dcr)
0.43 mOhm
Package / Case
0.315" L x 0.472" W x 0.236" H (8.00mm x 12.00mm x 6.00mm)
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 125°C
Frequency - Test
100kHz
Material - Core
Ferrite
Applications
General Purpose
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Shielding
-
Q @ Freq
-
Self Resonant Freq
-
Current - Temperature Rise
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
FP1206R1-R40-R
Manufacturer:
COOPER
Quantity:
20 000
High Current, High Frequency, Power Inductors
FLAT-PAC™ FP1206 Series
Description
• Halogen free
• 125°C maximum total temperature operation
• 8.0 x12.0 x 6.0mm surface mount package
• Ferrite core material
• High current carrying capacity, low core losses
• Designed for high speed, high current switch mode applications
• Controlled DCR tolerance for sensing circuits
• Inductance range from 120nH to 400nH
• Current range from 24 to 88 amps
• Frequency range up to 1MHz
• RoHS compliant
1 Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.1V rms , 0.0Adc
2 Full Load Inductance (FLL) Test Parameters: 100kHz, .01V rms , I sat 1
3 I rms : DC current for an approximate temperature rise of 40°C without core loss. Derating is
4 I sat 1: Peak current for approximately 20% rolloff at +25°C.
0409
Part
Number
FP1206R1-R12-R
FP1206R1-R15-R
FP1206R1-R25-R
FP1206R1-R30-R
FP1206R1-R40-R
SMD Device
necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other
heat generating components will affect the temperature rise. It is recommended that the
temperature of the part not exceed 125°C under worst case operating conditions verified in the
end application.
SMD Device
BU-SB09349
7
± 10% (nH)
OCL
120
150
250
300
400
1
Min. (nH)
FLL
108
180
216
288
86
2
Product Specifications
(Amps)
I rms
50
3
5 I sat 2: Peak current for approximately 20% rolloff at +125°C.
6 K-factor: Used to determine B p-p for core loss (see graph). B p-p = K * L * ΔI * 10
7 Part Number Definition: FP1206Rx-Rxx-R
Applications
• Multi-phase regulators
• Voltage Regulator Module (VRM)
• Desktop and server VRMs and EVRDs
• Data networking and storage systems
• Notebook regulators
• Graphics cards and battery power systems
• Point of load modules
• DCR current sensing
Environmental Data
• Storage temperature range: -40°C to +125°C
• Operating temperature range: -40°C to +125°C
• Solder reflow temperature: J-STD-020D compliant
Packaging
• Supplied in tape-and-reel packaging, 620 parts per reel,
(K-factor from table), L: (Inductance in nH), ΔI (Peak-to-peak ripple current in amps).
• FP1206 = Product code and size
• Rx= DCR indicator
• Rxx= Inductance value in uH, R = decimal point
• -R suffix = RoHS compliant
(with derated current)
13” diameter reel
Page 1 of 4
(Amps) @25°C
I sat 1
88
70
43
34
24
4
(Amps) @125°C
Data Sheet: 4366
I sat 2
65
51
32
26
19
5
0.43 ± 6.5%
DCR (mΩ)
@20°C
HF
FREE
HALOGEN
-3
. B p-p :(Gauss), K:
K-factor
358
358
358
358
358
6

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FP1206R1-R40-R Summary of contents

Page 1

... FP1206R1-R25-R 250 FP1206R1-R30-R 300 FP1206R1-R40-R 400 1 Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.1V rms , 0.0Adc 2 Full Load Inductance (FLL) Test Parameters: 100kHz, .01V rms , I sat rms : DC current for an approximate temperature rise of 40°C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise recommended that the temperature of the part not exceed 125° ...

Page 2

Dimensions - iew iew ± 0 llyy R b The nominal DCR is measured between points “a” ...

Page 3

Core Loss 10 1 0.1 0.01 0.001 0.0001 100 Inductance Characteristics 1 00% 80% 60% 40% 20 20% 0409 BU-SB09349 1000 ...

Page 4

Solder Reflow Profile T P Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C Preheat A T smax T smin t s 25°C Time 25°C to Peak Reference JDEC J-STD-020D Profile Feature Preheat and Soak ...

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