PIC16F506-I/SL Microchip Technology, PIC16F506-I/SL Datasheet - Page 59

IC PIC MCU FLASH 1KX14 14SOIC

PIC16F506-I/SL

Manufacturer Part Number
PIC16F506-I/SL
Description
IC PIC MCU FLASH 1KX14 14SOIC
Manufacturer
Microchip Technology
Series
PIC® 16Fr

Specifications of PIC16F506-I/SL

Program Memory Type
FLASH
Program Memory Size
1.5KB (1K x 12)
Package / Case
14-SOIC (3.9mm Width), 14-SOL
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Peripherals
POR, WDT
Number Of I /o
11
Ram Size
67 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 4x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
67 B
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
12
Number Of Timers
1
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000
Minimum Operating Temperature
- 40 C
On-chip Adc
3-ch x 8-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Connectivity
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

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PIC16F506-I/SL
0
REGISTER 10-2:
© 2006 Microchip Technology Inc.
bit 11
bit 11-7: Unimplemented: Read as ‘1’
bit 6:
bit 5:
bit 4:
bit 3:
bit 2-0:
Legend:
R = Readable bit
-n = bLANK
IOSCFS: Internal Oscillator Frequency Select bit
1 = 8 MHz INTOSC speed
0 = 4 MHz INTOSC speed
MCLRE: Master Clear Enable bit
1 = RB3/MCLR pin functions as MCLR
0 = RB3/MCLR pin functions as RB3, MCLR tied internally to V
CP: Code Protection bit
1 = Code protection off
0 = Code protection on
WDTE: Watchdog Timer Enable bit
1 = WDT enabled
0 = WDT disabled
FOSC2:FOSC0: Oscillator Selection bits
000 = LP oscillator and 18 ms DRT
001 = XT oscillator and 18 ms DRT
010 = HS oscillator and 18 ms DRT
011 = EC oscillator with RB4 function on RB4/OSC2/CLKOUT and 1.125 ms DRT
100 = INTOSC with RB4 function on RB4/OSC2/CLKOUT and 1.125 ms DRT
101 = INTOSC with CLKOUT function on RB4/OSC2/CLKOUT and 1.125 ms DRT
110 = EXTRC with RB4 function on RB4/OSC2/CLKOUT and 1.125 ms DRT
111 = EXTRC with CLKOUT function on RB4/OSC2/CLKOUT and 1.125 ms DRT
Note 1: Refer to the “PIC16F506 Memory Programming Specification”, DS41258, to determine how to
2: It is the responsibility of the application designer to ensure the use of the 1.125 ms (nominal)
CONFIGURATION WORD – PIC16F506
access the Configuration Word.
DRT will result in acceptable operation. Refer to Electrical Specifications for V
stability requirements for this mode of operation.
W = Writable bit
‘1’ = bit is set
IOSCFS MCLRE
Preliminary
U = Unimplemented bit, read as ‘0’
‘0’ = bit is cleared
PIC12F510/16F506
CP
DD
WDTE
(1), (2)
(1), (2)
FOSC2 FOSC1 FOSC0
x = bit is unknown
(1), (2)
(1), (2)
(1), (2)
DS41268B-page 57
DD
rise time and
bit 0

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