PIC16F616-I/SL Microchip Technology, PIC16F616-I/SL Datasheet - Page 156

IC PIC MCU FLASH 2KX14 14SOIC

PIC16F616-I/SL

Manufacturer Part Number
PIC16F616-I/SL
Description
IC PIC MCU FLASH 2KX14 14SOIC
Manufacturer
Microchip Technology
Series
PIC® 16Fr

Specifications of PIC16F616-I/SL

Program Memory Type
FLASH
Program Memory Size
3.5KB (2K x 14)
Package / Case
14-SOIC (3.9mm Width), 14-SOL
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
11
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
128 B
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
11
Number Of Timers
3
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 8 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
MCP1631RD-DCPC1 - REF DES BATT CHARG OR LED DRIVERAC162083 - HEADER MPLAB ICD2 PIC16F616 8/14
Eeprom Size
-
Connectivity
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

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PIC16F610/616/16HV610/616
TABLE 15-4:
DS41288C-page 154
Standard Operating Conditions (unless otherwise stated)
Operating Temperature
30
31
32
33*
34*
35*
36*
37*
Legend: TBD = To Be Determined
Note 1:
Param
No.
2:
3:
4:
*
† Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance
T
T
T
T
T
V
V
T
OST
MC
WDT
PWRT
IOZ
BOR
BOR
HYST
These parameters are characterized but not tested.
only and are not tested.
Instruction cycle period (T
are based on characterization data for that particular oscillator type under standard operating conditions
with the device executing code. Exceeding these specified limits may result in an unstable oscillator oper-
ation and/or higher than expected current consumption. All devices are tested to operate at “min” values
with an external clock applied to the OSC1 pin. When an external clock input is used, the “max” cycle time
limit is “DC” (no clock) for all devices.
By design.
Period of the slower clock.
To ensure these voltage tolerances, V
possible. 0.1 μF and 0.01 μF values in parallel are recommended.
Sym
L
RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, POWER-UP TIMER
AND BROWN-OUT RESET PARAMETERS
MCLR Pulse Width (low)
Watchdog Timer Time-out
Period (No Prescaler)
Oscillation Start-up Timer
Period
Power-up Timer Period
I/O High-impedance from
MCLR Low or Watchdog Timer
Reset
Brown-out Reset Voltage
Brown-out Reset Hysteresis
Brown-out Reset Minimum
Detection Period
(1, 2)
-40°C ≤ T
Characteristic
A
CY
≤ +125°C
) equals four times the input oscillator time base period. All specified values
DD
Preliminary
and V
TBD
TBD
Min
100
40
2
5
7
SS
must be capacitively decoupled as close to the device as
Typ†
1024
2.1
18
18
65
50
TBD
TBD
Max Units
140
2.0
33
T
mV
ms
ms
ms
OSC
μs
μs
μs
μs
V
V
V
V
V
(NOTE 3)
(NOTE 4)
V
© 2007 Microchip Technology Inc.
DD
DD
DD
DD
DD
= 5V, -40°C to +85°C
= 5V, +85°C to +125°C
= 5V, -40°C to +85°C
= 5V, +85°C to +125°C
≤ V
BOR
Conditions

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