PIC12C508A-04/P Microchip Technology, PIC12C508A-04/P Datasheet - Page 2

• Manufacturer Part Number: PIC12C508A-04/P
• Description: IC MCU OTP 512X12 8DIP
• Manufacturer: Microchip Technology
• Series: PIC® 12Cr

Specifications of PIC12C508A-04/P

• Program Memory Type: OTP
• Program Memory Size: 768B (512 x 12)
• Package / Case: 8-DIP (0.300", 7.62mm)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 4MHz
• Peripherals: POR, WDT
• Number Of I /o: 5
• Ram Size: 25 x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 5.5 V
• Oscillator Type: Internal
• Operating Temperature: 0°C ~ 70°C
• Processor Series: PIC12C
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 25 B
• Maximum Clock Frequency: 4 MHz
• Number Of Programmable I/os: 5
• Number Of Timers: 1
• Operating Supply Voltage: 2.5 V to 5.5 V
• Maximum Operating Temperature: + 70 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: DVMCPA, ICE2000
• Minimum Operating Temperature: 0 C
• Package: 8PDIP
• Device Core: PIC
• Family Name: PIC12
• Maximum Speed: 4 MHz
• Height: 3.3 mm
• Length: 9.27 mm
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 2.5 V
• Width: 6.35 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: ISPICR1 - ADAPTER IN-CIRCUIT PROGRAMMINGDVMCPA - KIT DVR BOARD EVAL SYSTEM MXDEV1DVA12XP080 - ADAPTER DEVICE FOR MPLAB-ICEAC124001 - MODULE SKT PROMATEII 8DIP/SOIC
• Eeprom Size: -
• Data Converters: -
• Connectivity: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PIC12C508A/509A
13.2
DS80024B-page 2
Parm
No.
* These parameters are characterized but not tested.
Note 1: Data in the Typical (“Typ”) column is based on characterization results at 25 C. This data is for design guidance only and is
2: This is the limit to which V
3: The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus loading, oscillator
4: Does not include current through Rext. The current through the resistor can be estimated by the formula:
5: The power down current in SLEEP mode does not depend on the oscillator type. Power down current is measured with the
DC CHARACTERISTICS:
not tested.
type, bus rate, internal code execution pattern, and temperature also have an impact on the current consumption.
I
part in SLEEP mode, with all I/O pins in hi-impedance state and tied to V
R
= V
a) The test conditions for all I
b) For standby current measurements, the conditions are the same, except that the device is in SLEEP mode.
DC Characteristics
Power Supply Pins
DD
OSC1 = external square wave, from rail-to-rail; all I/O pins tristated, pulled to Vss,
T0CKI = V
Characteristic
/2Rext (mA) with Rext in kOhm.
DD
, MCLR = V
DD
can be lowered in SLEEP mode without losing RAM data.
DD
DD
; WDT enabled/disabled as specified.
measurements in active operation mode are:
PIC12LC508A/509A (Commercial, Industrial)
PIC12LCE518/519 (Commercial, Industrial)
PIC12LCR509A (Commercial, Industrial)
Sym
I
WDT
Standard Operating Conditions (unless otherwise specified)
Operating Temperature
Min Typ
–
2.0
2.0
(1)
Max
4
5
Units
A
A
DD
–40 C
or V
V
V
DD
DD
0 C
SS
= 2.5V, Commercial
= 2.5V, Industrial
.
T
T
A
A
2000 Microchip Technology Inc.
+85 C (industrial)
+70 C (commercial)
Conditions