PIC12C508A-04I/SM Microchip Technology, PIC12C508A-04I/SM Datasheet - Page 9

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PIC12C508A-04I/SM

Manufacturer Part Number
PIC12C508A-04I/SM
Description
IC MCU OTP 512X12 8-SOIJ
Manufacturer
Microchip Technology
Series
PIC® 12Cr

Specifications of PIC12C508A-04I/SM

Core Size
8-Bit
Program Memory Size
768B (512 x 12)
Core Processor
PIC
Speed
4MHz
Peripherals
POR, WDT
Number Of I /o
5
Program Memory Type
OTP
Ram Size
25 x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
8-SOIC (5.3mm Width), 8-SOP, 8-SOEIAJ
Controller Family/series
PIC12
No. Of I/o's
6
Ram Memory Size
25Byte
Cpu Speed
4MHz
No. Of Timers
1
Digital Ic Case Style
SOIC
Processor Series
PIC12C
Core
PIC
Data Bus Width
8 bit
Data Ram Size
25 B
Maximum Clock Frequency
4 MHz
Number Of Programmable I/os
5
Number Of Timers
8
Operating Supply Voltage
2.5 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
DVMCPA, ICE2000
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT08SO-1 - SOCKET TRANSITION 8SOIC 150/208AC164312 - MODULE SKT FOR PM3 16SOICISPICR1 - ADAPTER IN-CIRCUIT PROGRAMMING309-1048 - ADAPTER 8-SOIC TO 8-DIP309-1047 - ADAPTER 8-SOIC TO 8-DIPAC124001 - MODULE SKT PROMATEII 8DIP/SOIC
Eeprom Size
-
Data Converters
-
Connectivity
-
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC12C508A-04I/SM
Manufacturer:
DIODES
Quantity:
7 600
Part Number:
PIC12C508A-04I/SM
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
3.
The package information contained in the data sheet is
incorrect. Please refer to the following tables for correct
package data.
8-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
 2003 Microchip Technology Inc.
Module: Packaging
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-018
n
β
eB
E1
E
Dimension Limits
§
Units
2
1
A2
E1
B1
eB
A1
D
p
A
E
L
B
α
PIC12C508A/C509A/CR509A
n
c
β
c
D
MIN
.115
.015
.240
.125
.008
.045
.310
.140
.300
.360
.014
5
5
INCHES*
NOM
A
A1
.100
.155
.130
.313
.250
.373
.130
.012
.058
.018
.370
10
10
8
B1
B
MAX
.170
.145
.325
.260
.385
.135
.015
.070
.022
.430
15
15
MIN
3.56
2.92
0.38
7.62
6.10
9.14
3.18
0.20
1.14
0.36
7.87
5
5
MILLIMETERS
NOM
α
2.54
3.94
3.30
7.94
6.35
9.46
3.30
0.29
1.46
0.46
9.40
10
10
8
p
A2
MAX
DS80063D-page 9
10.92
L
4.32
3.68
8.26
6.60
9.78
3.43
0.38
1.78
0.56
15
15

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