PIC16F688-I/SL Microchip Technology, PIC16F688-I/SL Datasheet - Page 193
PIC16F688-I/SL
Manufacturer Part Number
PIC16F688-I/SL
Description
IC PIC MCU FLASH 4KX14 14SOIC
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F688T-ISL.pdf
(204 pages)
3.PIC16F688T-ISL.pdf
(6 pages)
4.PIC16F688T-ISL.pdf
(4 pages)
5.PIC16F688T-ISL.pdf
(688 pages)
6.PIC16F688-EP.pdf
(174 pages)
Specifications of PIC16F688-I/SL
Program Memory Type
FLASH
Program Memory Size
7KB (4K x 14)
Package / Case
14-SOIC (3.9mm Width), 14-SOL
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
UART/USART
Peripherals
Brown-out Detect/Reset, POR, WDT
Number Of I /o
12
Eeprom Size
256 x 8
Ram Size
256 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
256 B
Interface Type
SCI, USART
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
12
Number Of Timers
1
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163014, DM164120-4
Minimum Operating Temperature
- 40 C
On-chip Adc
8 bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT14SO-1 - SOCKET TRANSITION 14SOIC 150/208AC162061 - HEADER INTRFC MPLAB ICD2 20PINAC162056 - HEADER INTERFACE ICD2 16F688
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16F688-I/SL
Manufacturer:
MICROCHIP
Quantity:
4 952
Company:
Part Number:
PIC16F688-I/SL
Manufacturer:
Microchip Technology
Quantity:
27 564
Part Number:
PIC16F688-I/SL
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
© 2009 Microchip Technology Inc.
16-Lead Plastic Quad Flat, No Lead Package (ML) – 4x4x0.9 mm Body [QFN]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated.
3. Dimensioning and tolerancing per ASME Y14.5M.
Note:
E
A
A1
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Width
Exposed Pad Width
Overall Length
Exposed Pad Length
Contact Width
Contact Length
Contact-to-Exposed Pad
TOP VIEW
D
N
Dimension Limits
2
1
EXPOSED
NOTE 1
A3
Units
A1
A3
E2
D2
D
N
A
E
K
e
b
L
E2
PAD
1
2
MIN
0.80
0.00
2.50
2.50
0.25
0.30
0.20
MILLIMETERS
BOTTOM VIEW
N
4.00 BSC
0.65 BSC
0.20 REF
4.00 BSC
NOM
0.90
0.02
2.65
2.65
0.30
0.40
16
–
Microchip Technology Drawing C04-127B
D2
PIC16F688
MAX
1.00
0.05
2.80
2.80
0.35
0.50
–
DS41203E-page 191
L
K
b
e