PIC24F04KA201-I/SS Microchip Technology, PIC24F04KA201-I/SS Datasheet - Page 188

• Manufacturer Part Number: PIC24F04KA201-I/SS
• Description: IC PIC MCU FLASH 512KX4 20-SSOP
• Manufacturer: Microchip Technology
• Series: PIC® XLP™ 24Fr

Specifications of PIC24F04KA201-I/SS

• Core Size: 16-Bit
• Program Memory Size: 4KB (1.375K x 24)
• Peripherals: Brown-out Detect/Reset, HLVD, POR, PWM, WDT
• Core Processor: PIC
• Speed: 32MHz
• Connectivity: I²C, IrDA, SPI, UART/USART
• Number Of I /o: 18
• Program Memory Type: FLASH
• Ram Size: 512 x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 9x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-SSOP
• Controller Family/series: PIC24
• No. Of I/o's: 18
• Ram Memory Size: 512Byte
• Cpu Speed: 32MHz
• No. Of Timers: 3
• Processor Series: PIC24F
• Core: PIC
• Data Bus Width: 16 bit
• Data Ram Size: 512 B
• Interface Type: I2C, SPI, UART
• Maximum Clock Frequency: 32 KHz
• Number Of Programmable I/os: 12
• Number Of Timers: 3
• Operating Supply Voltage: 1.8 V to 3.6 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, DM240001
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 9 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

PIC24F04KA201 FAMILY
26.1
FIGURE 26-1:
TABLE 26-1:
TABLE 26-2:
DS39937B-page 186
Operating Junction Temperature Range
Operating Ambient Temperature Range
Power Dissipation:
Maximum Allowed Power Dissipation
Package Thermal Resistance, 14-Pin PDIP
Package Thermal Resistance, 20-Pin PDIP
Package Thermal Resistance, 14-Pin SSOP
Package Thermal Resistance, 20-Pin SSOP
Package Thermal Resistance, 14-Pin SOIC
Package Thermal Resistance, 20-Pin SOIC
Package Thermal Resistance, 14-Pin QFN
Package Thermal Resistance, 20-Pin QFN
Note 1:
Internal Chip Power Dissipation:
I/O Pin Power Dissipation:
Note:
DC Characteristics
P
P
INT
I
/
O
Junction to ambient thermal resistance, Theta-
= Σ ({V
= V
For frequencies between 8 MHz and 32 MHz, F
3.60V
3.00V
1.80V
DD
THERMAL OPERATING CONDITIONS
THERMAL PACKAGING CHARACTERISTICS
x (I
DD
PIC24F04KA201 FAMILY VOLTAGE-FREQUENCY GRAPH (INDUSTRIAL)
DD
– V
Characteristic
– Σ I
OH
} x I
Rating
OH
OH
)
) + Σ (V
8 MHz
OL
x I
OL
Preliminary
)
Frequency
JA
(θ
JA
MAX
) numbers are achieved by package simulations.
= 20 MHz *(V
Symbol
Symbol
P
DMAX
θ
θ
θ
θ
θ
θ
θ
θ
P
T
T
JA
JA
JA
JA
JA
JA
JA
JA
A
D
J
62.4
80.2
Min
Typ
108
-40
-40
DD
60
71
75
43
32
– 1.8) + 8 MHz.
(T
© 2009 Microchip Technology Inc.
P
J
INT
– T
Max
Typ
—
—
—
—
—
—
—
—
—
—
32 MHz
+ P
A
)/θ
I
/
O
JA
3.00V
3.60V
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
+125
Max
Unit
+85
Notes
Unit
°C
°C
W
W
1
1
1
1
1
1
1
1