PIC16LF726-I/SP Microchip Technology, PIC16LF726-I/SP Datasheet - Page 216
![IC PIC MCU FLASH 8K 1.8V 28-DIP](/photos/6/59/65908/150-28-dip_sml.jpg)
PIC16LF726-I/SP
Manufacturer Part Number
PIC16LF726-I/SP
Description
IC PIC MCU FLASH 8K 1.8V 28-DIP
Manufacturer
Microchip Technology
Series
PIC® XLP™ 16Fr
Specifications of PIC16LF726-I/SP
Core Size
8-Bit
Program Memory Size
14KB (8K x 14)
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Core Processor
PIC
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Number Of I /o
25
Program Memory Type
FLASH
Ram Size
368 x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 11x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
28-DIP (0.300", 7.62mm)
Controller Family/series
PIC16LF
No. Of I/o's
25
Ram Memory Size
368Byte
Cpu Speed
20MHz
No. Of Timers
3
Processor Series
PIC16LF
Core
PIC
Data Bus Width
8 bit
Data Ram Size
368 B
Interface Type
I2C, SCI, SPI
Maximum Clock Frequency
32 KHz
Number Of Programmable I/os
25
Number Of Timers
3
Operating Supply Voltage
1.8 V to 3.6 V
Maximum Operating Temperature
+ 125 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120
Minimum Operating Temperature
- 40 C
On-chip Adc
8 bit, 11 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16LF726-I/SP
Manufacturer:
Microchip Technology
Quantity:
135
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PIC16F72X/PIC16LF72X
23.3
DS41341B-page 214
PIC16LF72X
PIC16F72X
D020
D020
D021
D021
D021A
D021A
D022
D022
D026
D026
Note 1:
Param
No.
2:
3:
4:
5:
*
†
DC Characteristics: PIC16F72X/PIC16LF72X-I/E (Power-Down)
Power-down Base Current (I
These parameters are characterized but not tested.
Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are
not tested.
The peripheral current is the sum of the base I
enabled. The peripheral Δ current can be determined by subtracting the base I
values should be used when calculating total current consumption.
The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with
the part in Sleep mode, with all I/O pins in high-impedance state and tied to V
Fixed Voltage Reference is automatically enabled whenever the BOR is enabled
A/D oscillator source is F
0.1 μF capacitor on V
Device Characteristics
CAP
RC
(RA0).
PD
Min.
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
)
(2)
Standard Operating Conditions (unless otherwise stated)
Operating temperature
Standard Operating Conditions (unless otherwise stated)
Operating temperature
Typ†
0.06
0.08
4.5
5.5
0.5
0.8
6.5
7.5
8.5
8.5
7.5
0.6
1.8
4.5
39
39
40
38
40
—
—
5
6
6
7
Preliminary
DD
+85°C
Max.
10.2
10.5
13.5
14.5
12.5
13.5
11.8
11.1
0.7
1.0
1.7
3.5
16
14
14
44
45
60
—
12
—
42
46
or I
3
2
PD
and the additional current consumed when this peripheral is
+125°C
Max.
14.2
16.8
18.7
16.4
16.8
18.7
3.9
4.3
4.1
4.8
18
18
48
49
70
18
49
50
—
—
—
—
—
—
—
-40°C ≤ T
-40°C ≤ T
-40°C ≤ T
-40°C ≤ T
Units
mA
μA
μA
μA
μA
μA
μA
μA
μA
μA
μA
μA
μA
μA
μA
μA
μA
μA
μA
μA
μA
μA
μA
μA
μA
A
A
A
A
V
≤ +85°C for industrial
≤ +125°C for extended
≤ +85°C for industrial
≤ +125°C for extended
1.8
3.0
1.8
3.0
5.0
1.8
3.0
1.8
3.0
5.0
1.8
3.0
1.8
3.0
5.0
1.8
3.0
1.8
3.0
5.0
1.8
3.0
1.8
3.0
5.0
DD
DD
DD
.
or I
PD
WDT, BOR, FVR, and T1OSC
disabled, all Peripherals Inactive
WDT, BOR, FVR, and T1OSC
disabled, all Peripherals Inactive
LPWDT Current (Note 1)
LPWDT Current (Note 1)
FVR current (Note 3)
FVR current (Note 3, Note 5)
BOR Current (Note 1, Note 3)
BOR Current (Note 1, Note 3,
Note 5)
T1OSC Current (Note 1)
T1OSC Current (Note 1)
© 2008 Microchip Technology Inc.
current from this limit. Max
Conditions
Note
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