PIC12C672-04/P Microchip Technology, PIC12C672-04/P Datasheet - Page 10
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PIC12C672-04/P
Manufacturer Part Number
PIC12C672-04/P
Description
IC MCU OTP 2KX14 A/D 8DIP
Manufacturer
Microchip Technology
Series
PIC® 12Cr
Datasheets
1.PIC16F688T-ISL.pdf
(688 pages)
2.PIC12CE673-10P.pdf
(129 pages)
3.PIC12CE673-10P.pdf
(14 pages)
Specifications of PIC12C672-04/P
Core Size
8-Bit
Program Memory Size
3.5KB (2K x 14)
Core Processor
PIC
Speed
4MHz
Peripherals
POR, WDT
Number Of I /o
5
Program Memory Type
OTP
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 4x8b
Oscillator Type
Internal
Operating Temperature
0°C ~ 70°C
Package / Case
8-DIP (0.300", 7.62mm)
Controller Family/series
PIC12
No. Of I/o's
6
Ram Memory Size
128Byte
Cpu Speed
4MHz
No. Of Timers
1
Digital Ic Case Style
DIP
Processor Series
PIC12C
Core
PIC
Data Bus Width
8 bit
Data Ram Size
128 B
Maximum Clock Frequency
4 MHz
Number Of Programmable I/os
5
Number Of Timers
8
Maximum Operating Temperature
+ 70 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
ICE2000
Minimum Operating Temperature
0 C
On-chip Adc
8
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
ISPICR1 - ADAPTER IN-CIRCUIT PROGRAMMINGAC124001 - MODULE SKT PROMATEII 8DIP/SOIC
Eeprom Size
-
Connectivity
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC12C672-04/P
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
PIC12C67X
8.
Added 8-Lead Plastic Micro Leadframe Package (MF)
and (MLF-S).
8-Lead Plastic Micro Leadframe Package (MF) 6x5 mm Body (MLF-S)
DS80067C-page 10
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC equivalent: pending
Drawing No. C04-113
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Base Thickness
Overall Length
Molded Package Length
Exposed Pad Length
Overall Width
Molded Package Width
Exposed Pad Width
Lead Width
Lead Length
Tie Bar Width
Mold Draft Angle Top
Module:
A1
n
PACKAGING INFORMATION
1
TOP VIEW
2
E1
E
Dimension Limits
Units
D1
D2
A2
A1
A3
E1
E2
D
R
n
p
A
E
B
L
D1
A2
D
A3
MIN
.000
.152
.085
.014
.020
A
.008 REF.
INCHES
.050 BSC
.194 BSC
.184 BSC
.236 BSC
.226 BSC
NOM
EXPOSED
.0004
.033
.026
.158
.091
.016
.024
.014
METAL
PADS
8
MAX
R
.039
.031
.002
.163
.097
.019
.030
12
B
BOTTOM VIEW
MIN
E2
0.00
3.85
2.16
0.35
0.50
MILLIMETERS*
2001 Microchip Technology Inc.
p
0.20 REF.
1.27 BSC
4.92 BSC
4.67 BSC
5.99 BSC
5.74 BSC
NOM
0.85
0.65
0.01
4.00
2.31
0.40
0.60
.356
PIN 1
L
8
ID
D2
MAX
1.00
0.80
0.05
4.15
2.46
0.47
0.75
12