PIC12C671-04/SM Microchip Technology, PIC12C671-04/SM Datasheet - Page 10

• Manufacturer Part Number: PIC12C671-04/SM
• Description: IC MCU OTP 1KX14 A/D 8-SOIJ
• Manufacturer: Microchip Technology
• Series: PIC® 12Cr

Specifications of PIC12C671-04/SM

• Core Size: 8-Bit
• Program Memory Size: 1.75KB (1K x 14)
• Core Processor: PIC
• Speed: 4MHz
• Peripherals: POR, WDT
• Number Of I /o: 5
• Program Memory Type: OTP
• Ram Size: 128 x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 5.5 V
• Data Converters: A/D 4x8b
• Oscillator Type: Internal
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 8-SOIC (5.3mm Width), 8-SOP, 8-SOEIAJ
• Controller Family/series: PIC12
• No. Of I/o's: 6
• Ram Memory Size: 128Byte
• Cpu Speed: 4MHz
• No. Of Timers: 1
• Digital Ic Case Style: SOIC
• Processor Series: PIC12C
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 128 B
• Maximum Clock Frequency: 4 MHz
• Number Of Programmable I/os: 5
• Number Of Timers: 1
• Operating Supply Voltage: 3 V to 5.5 V
• Maximum Operating Temperature: + 70 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: ICE2000
• Minimum Operating Temperature: 0 C
• On-chip Adc: 8 bit, 4 Channel
• Package: 8SOIJ
• Device Core: PIC
• Family Name: PIC12
• Maximum Speed: 4 MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AC164312 - MODULE SKT FOR PM3 16SOICISPICR1 - ADAPTER IN-CIRCUIT PROGRAMMING309-1048 - ADAPTER 8-SOIC TO 8-DIP309-1047 - ADAPTER 8-SOIC TO 8-DIPAC124001 - MODULE SKT PROMATEII 8DIP/SOIC
• Eeprom Size: -
• Connectivity: -
• Lead Free Status / Rohs Status: Details

PIC12C67X
8.
Added 8-Lead Plastic Micro Leadframe Package (MF)
and (MLF-S).
8-Lead Plastic Micro Leadframe Package (MF) 6x5 mm Body (MLF-S)
DS80067C-page 10
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC equivalent: pending
Drawing No. C04-113
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Base Thickness
Overall Length
Molded Package Length
Exposed Pad Length
Overall Width
Molded Package Width
Exposed Pad Width
Lead Width
Lead Length
Tie Bar Width
Mold Draft Angle Top
Module:
A1
n
PACKAGING INFORMATION
1
TOP VIEW
2
E1
E
Dimension Limits
Units
D1
D2
A2
A1
A3
E1
E2
D
R
n
p
A
E
B
L
D1
A2
D
A3
MIN
.000
.152
.085
.014
.020
A
.008 REF.
INCHES
.050 BSC
.194 BSC
.184 BSC
.236 BSC
.226 BSC
NOM
EXPOSED
.0004
.033
.026
.158
.091
.016
.024
.014
METAL
PADS
8
MAX
R
.039
.031
.002
.163
.097
.019
.030
12
B
BOTTOM VIEW
MIN
E2
0.00
3.85
2.16
0.35
0.50
MILLIMETERS*
2001 Microchip Technology Inc.
p
0.20 REF.
1.27 BSC
4.92 BSC
4.67 BSC
5.99 BSC
5.74 BSC
NOM
0.85
0.65
0.01
4.00
2.31
0.40
0.60
.356
PIN 1
L
8
ID
D2
MAX
1.00
0.80
0.05
4.15
2.46
0.47
0.75
12