PIC16F887-I/PT Microchip Technology, PIC16F887-I/PT Datasheet - Page 2
![IC PIC MCU FLASH 8KX14 44TQFP](/photos/6/82/68251/c04-076_pt_sml.jpg)
PIC16F887-I/PT
Manufacturer Part Number
PIC16F887-I/PT
Description
IC PIC MCU FLASH 8KX14 44TQFP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.MCP1631RD-MCC2.pdf
(328 pages)
3.PIC16F882-ISS.pdf
(16 pages)
4.PIC16F882-ISS.pdf
(36 pages)
5.PIC16F883-ISO.pdf
(288 pages)
Specifications of PIC16F887-I/PT
Program Memory Type
FLASH
Program Memory Size
14KB (8K x 14)
Package / Case
44-TQFP, 44-VQFP
Mfg Application Notes
Intro to Capacitive Sensing Appl Notes Layout and Physical Design Appl Note
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
35
Eeprom Size
256 x 8
Ram Size
368 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 14x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
368 B
Interface Type
MSSP/EUSART
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
35
Number Of Timers
3
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 53273-916
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM164123, DM164120-3, DV164122
Minimum Operating Temperature
- 40 C
On-chip Adc
14-ch x 10-bit
Package
44TQFP
Device Core
PIC
Family Name
PIC16
Maximum Speed
20 MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DM164125 - BOARD DEMO PICDEM TOUCH SENSE 1XLT44PT3 - SOCKET TRAN ICE 44MQFP/TQFPAC164305 - MODULE SKT FOR PM3 44TQFP444-1001 - DEMO BOARD FOR PICMICRO MCU
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16F887-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
PIC16F88X
TABLE 2:
TABLE 3:
DS80302F-page 2
LVP
MSSP
ADC
MSSP
MSSP
MSSP
MSSP
Timer1
Timer1
Timer0
MSSP
Note 1:
LVP
MSSP
ADC
MSSP
MSSP
MSSP
MSSP
Timer1
Timer1
Timer0
MSSP
Note 1:
Module
Module
Only those issues indicated in the last column apply to the current silicon revision.
Only those issues indicated in the last column apply to the current silicon revision.
VP6 Reference
VP6 Reference
Programming
Programming
I
I
I
2
I
2
Ext. Crystal
Ext. Crystal
Ext. Crystal
Ext. Crystal
SPI Master
SPI Master
SPI Master
SPI Master
SPI Master
SPI Master
2
2
C™ Master
SPI Slave
C™ Master
SPI Slave
Prescaler
Prescaler
SILICON ISSUE SUMMARY (PIC16F882)
SILICON ISSUE SUMMARY (PIC16F883/PIC16F884)
C™ Slave
C™ Slave
Feature
Feature
Number
Number
Item
Item
10.
10.
11.
11.
1.
6.
1.
6.
2.
3.
4.
5.
7.
8.
9.
2.
3.
4.
5.
7.
8.
9.
Programming disruption
SPI using Timer2/2
Disruption of the HFINTOSC
Write collision on loading
R/W bit on ACK
Clock-stretching handling
Multi-byte transmission
Overflow may take additional count
Oscillator may stop running at low temps.
Spurious Reset
Disabling the module generates a clock
pulse.
Programming disruption
SPI using Timer2/2
Disruption of the HFINTOSC
Write collision on loading
R/W bit on ACK
Clock-stretching handling
Multi-byte transmission
Overflow may take additional count
Oscillator may stop running at low temps.
Spurious Reset
Disabling the module generates a clock
pulse.
Issue Summary
Issue Summary
© 2009 Microchip Technology Inc.
Affected Revisions
Affected Revisions
A0
A0
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
(1)
(1)