PIC16F818-I/SO Microchip Technology, PIC16F818-I/SO Datasheet - Page 4
![IC MCU FLASH 1KX14 18-SOIC](/photos/6/76/67656/150-18-soic_sml.jpg)
PIC16F818-I/SO
Manufacturer Part Number
PIC16F818-I/SO
Description
IC MCU FLASH 1KX14 18-SOIC
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F688T-ISL.pdf
(688 pages)
3.PIC16F818-ISO.pdf
(176 pages)
4.PIC16F818-ISO.pdf
(6 pages)
5.PIC16F818-ISO.pdf
(8 pages)
6.PIC16F818-ISO.pdf
(8 pages)
Specifications of PIC16F818-I/SO
Program Memory Type
FLASH
Program Memory Size
1.75KB (1K x 14)
Package / Case
18-SOIC (7.5mm Width)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
16
Eeprom Size
128 x 8
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Data Converters
A/D 5x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
128 B
Interface Type
I2C/SPI/SSP
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
16
Number Of Timers
3
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163014
Minimum Operating Temperature
- 40 C
On-chip Adc
5-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC164010 - MODULE SKT PROMATEII DIP/SOIC
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16F818-I/SO
Manufacturer:
MICROCHIP
Quantity:
3 290
Part Number:
PIC16F818-I/SO
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
SSP MODULE
REVISION HISTORY
Revision A Document (7/2002):
2
Original version (I
C Slave Issue).
Revision B Document (1/2003):
Clarification of original issue to include Restart
conditions. Addition of data sheet clarification 1 (SPI
Mode, CKE bit).
Revision C Document (3/2003):
Addition of data sheet clarification 2 (SPI Slave Mode,
operation).
Revision D Document (9/2004):
2
Updated list of affected devices for silicon issue 1 (I
C
– Slave Mode) and 2 (SSP – SPI, Slave Mode),
2
removed silicon issue 3 (I
C – Slave Mode). Updated
list of affected devices for data sheet clarification 1
(SSP – SPI Mode) and 2 (SSP – SPI Slave Mode).
2
Added data sheet clarification 3 (SSP – I
C Mode).
Revision E Document (7/2006):
Removed silicon issue 2 (SSP – SPI Slave Mode).
Revision F Document (2/2007):
Added four devices to list of devices affected by the
silicon errata and clarified the related language.
© 2007 Microchip Technology Inc.
DS80132F-page 4