PIC12C672-10I/P Microchip Technology, PIC12C672-10I/P Datasheet - Page 115
![no-image](/images/manufacturer_photos/0/4/439/microchip_technology_sml.jpg)
PIC12C672-10I/P
Manufacturer Part Number
PIC12C672-10I/P
Description
IC MCU OTP 2KX14 A/D 8DIP
Manufacturer
Microchip Technology
Series
PIC® 12Cr
Datasheets
1.PIC16F688T-ISL.pdf
(688 pages)
2.PIC12CE673-10P.pdf
(129 pages)
3.PIC12CE673-10P.pdf
(14 pages)
Specifications of PIC12C672-10I/P
Core Size
8-Bit
Program Memory Size
3.5KB (2K x 14)
Core Processor
PIC
Speed
10MHz
Peripherals
POR, WDT
Number Of I /o
5
Program Memory Type
OTP
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 4x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
8-DIP (0.300", 7.62mm)
Controller Family/series
PIC12
No. Of I/o's
6
Ram Memory Size
128Byte
Cpu Speed
10MHz
No. Of Timers
1
Digital Ic Case Style
DIP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
ISPICR1 - ADAPTER IN-CIRCUIT PROGRAMMINGAC124001 - MODULE SKT PROMATEII 8DIP/SOIC
Eeprom Size
-
Connectivity
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
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14.0
14.1
1999 Microchip Technology Inc.
*
PACKAGING INFORMATION
Package Marking Information
Standard OTP marking consists of Microchip part number, year code, week code, facility code, mask
rev#, and assembly code. For OTP marking beyond this, certain price adders apply. Please check with
your Microchip Sales Office. For QTP devices, any special marking adders are included in QTP price.
8-Lead SOIC (208 mil)
8-Lead PDIP (300 mil)
8-Lead Windowed Ceramic Side Brazed (300 mil)
MMMMMM
Legend: MM...M
AABBCDE
Note:
MMMMMMM
XXXXXXX
MMMMMMMM
XXXXXCDE
MM
AABB
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line thus limiting the number of available characters
for customer specific information.
XX...X
AA
BB
C
D
E
Microchip part number information
Customer specific information*
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Facility code of the plant at which wafer is manufactured
O = Outside Vendor
C = 5” Line
S = 6” Line
H = 8” Line
Mask revision number
Assembly code of the plant or country of origin in which
part was assembled
Example
Example
Example
CE674
9924SAZ
12CE674
04/PSAZ
12C671
04I/SM
JW
9925
PIC12C67X
DS30561B-page 115
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