PIC16F819-I/P Microchip Technology, PIC16F819-I/P Datasheet - Page 89
PIC16F819-I/P
Manufacturer Part Number
PIC16F819-I/P
Description
IC MCU FLASH 2KX14 18-DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F688T-ISL.pdf
(688 pages)
3.PIC16F818-ISO.pdf
(176 pages)
4.PIC16F818-ISO.pdf
(6 pages)
5.PIC16F818-ISO.pdf
(8 pages)
6.PIC16F818-ISO.pdf
(8 pages)
Specifications of PIC16F819-I/P
Program Memory Type
FLASH
Program Memory Size
3.5KB (2K x 14)
Package / Case
18-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
16
Eeprom Size
256 x 8
Ram Size
256 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Data Converters
A/D 5x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
256 B
Interface Type
I2C/SPI/SSP
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
16
Number Of Timers
3
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163014
Minimum Operating Temperature
- 40 C
On-chip Adc
5-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
ACICE0202 - ADAPTER MPLABICE 18P 300 MILAC164010 - MODULE SKT PROMATEII DIP/SOIC
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16F819-I/P
Manufacturer:
MICROCHIP
Quantity:
1 000
Company:
Part Number:
PIC16F819-I/P
Manufacturer:
MICROCHIP
Quantity:
1 000
- PIC16F616T-ISL PDF datasheet
- PIC16F688T-ISL PDF datasheet #2
- PIC16F818-ISO PDF datasheet #3
- PIC16F818-ISO PDF datasheet #4
- PIC16F818-ISO PDF datasheet #5
- PIC16F818-ISO PDF datasheet #6
- Current page: 89 of 688
- Download datasheet (3Mb)
Register 5-1:
1997 Microchip Technology Inc.
bit 7
bit 6:5
bit 4
bit 3
bit2
bit 1
bit 0
STATUS Register
bit 7
IRP: Register Bank Select bit (used for indirect addressing)
1 = Bank 2, 3 (100h - 1FFh)
0 = Bank 0, 1 (00h - FFh)
For devices with only Bank0 and Bank1 the IRP bit is reserved, always maintain this bit clear.
RP1:RP0: Register Bank Select bits (used for direct addressing)
11 = Bank 3 (180h - 1FFh)
10 = Bank 2 (100h - 17Fh)
01 = Bank 1 (80h - FFh)
00 = Bank 0 (00h - 7Fh)
Each bank is 128 bytes. For devices with only Bank0 and Bank1 the IRP bit is reserved,
always maintain this bit clear.
TO: Time-out bit
1 = After power-up, CLRWDT instruction, or SLEEP instruction
0 = A WDT time-out occurred
PD: Power-down bit
1 = After power-up or by the CLRWDT instruction
0 = By execution of the SLEEP instruction
Z: Zero bit
1 = The result of an arithmetic or logic operation is zero
0 = The result of an arithmetic or logic operation is not zero
DC: Digit carry/borrow bit (ADDWF, ADDLW, SUBLW, SUBWF instructions) (for borrow the polarity
is reversed)
1 = A carry-out from the 4th low order bit of the result occurred
0 = No carry-out from the 4th low order bit of the result
C: Carry/borrow bit (ADDWF, ADDLW,SUBLW,SUBWF instructions)
1 = A carry-out from the most significant bit of the result occurred
0 = No carry-out from the most significant bit of the result occurred
Legend
R = Readable bit
U = Unimplemented bit, read as ‘0’
R/W-0
Note:
IRP
For borrow the polarity is reversed. A subtraction is executed by adding the two’s
complement of the second operand. For rotate (RRF, RLF) instructions, this bit is
loaded with either the high or low order bit of the source register.
R/W-0
RP1
W = Writable bit
R/W-0
RP0
Section 5. CPU and ALU
R-1
TO
- n = Value at POR reset
R-1
PD
R/W-x
Z
R/W-x
DC
DS31005A-page 5-7
bit 0
R/W-x
C
5
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