PIC16F819-I/SS Microchip Technology, PIC16F819-I/SS Datasheet - Page 73

IC MCU FLASH 2KX14 20-SSOP

PIC16F819-I/SS

Manufacturer Part Number
PIC16F819-I/SS
Description
IC MCU FLASH 2KX14 20-SSOP
Manufacturer
Microchip Technology
Series
PIC® 16Fr

Specifications of PIC16F819-I/SS

Core Size
8-Bit
Program Memory Size
3.5KB (2K x 14)
Core Processor
PIC
Speed
20MHz
Connectivity
I²C, SPI
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
16
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
256 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Data Converters
A/D 5x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
20-SSOP
Controller Family/series
PIC16F
No. Of I/o's
16
Eeprom Memory Size
256Byte
Ram Memory Size
256Byte
Cpu Speed
20MHz
No. Of Timers
3
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
256 B
Interface Type
I2C, SPI, SSP
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
16
Number Of Timers
1 x 16 bit
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163014
Minimum Operating Temperature
- 40 C
On-chip Adc
5 bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT20SS-1 - SOCKET TRANSITION 18DIP 20SSOPAC164307 - MODULE SKT FOR PM3 28SSOP
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC16F819-I/SS
Manufacturer:
MICROCHIP
Quantity:
8 000
Part Number:
PIC16F819-I/SS
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
4.2
1997 Microchip Technology Inc.
OSC2/CLKOUT
(RC mode)
Clocking Scheme/Instruction Cycle
OSC1
Q4
PC
Q2
Q3
Q1
The clock input (from OSC1) is internally divided by four to generate four non-overlapping
quadrature clocks, namely Q1, Q2, Q3, and Q4. Internally, the program counter (PC) is incre-
mented every Q1, and the instruction is fetched from the program memory and latched into the
instruction register in Q4. The instruction is decoded and executed during the following Q1
through Q4. The clocks and instruction execution flow are illustrated in
Example
Figure 4-3: Clock/Instruction Cycle
Q1
Execute INST (PC-1)
Fetch INST (PC)
Q2
T
4-1.
CY
PC
1
Q3
Q4
Q1
Execute INST (PC)
Fetch INST (PC+1)
Section 4. Architecture
Q2
T
PC+1
CY
2
Q3
Q4
Q1
Execute INST (PC+1)
Fetch INST (PC+2)
Q2
T
PC+2
CY
3
Q3
Q4
DS31004A-page 4-5
Figure
Internal
phase
clock
4-3, and
4

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