PIC18F26J11-I/SO Microchip Technology, PIC18F26J11-I/SO Datasheet - Page 6
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PIC18F26J11-I/SO
Manufacturer Part Number
PIC18F26J11-I/SO
Description
IC PIC MCU FLASH 64K 2V 28-SOIC
Manufacturer
Microchip Technology
Series
PIC® XLP™ 18Fr
Datasheets
1.MA180023.pdf
(528 pages)
2.PIC18LF24J10-ISS.pdf
(32 pages)
3.PIC18F24J11-ISS.pdf
(14 pages)
4.PIC18F26J11-ISO.pdf
(28 pages)
Specifications of PIC18F26J11-I/SO
Program Memory Type
FLASH
Program Memory Size
64KB (32K x 16)
Package / Case
28-SOIC (7.5mm Width)
Core Processor
PIC
Core Size
8-Bit
Speed
48MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
16
Ram Size
3.8K x 8
Voltage - Supply (vcc/vdd)
2.15 V ~ 3.6 V
Data Converters
A/D 10x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
3776 B
Interface Type
EUSART, I2C, SPI
Maximum Clock Frequency
48 MHz
Number Of Timers
5
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DV164136, DM183032, MA180023, DM183022
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 10 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC164322 - MODULE SOCKET MPLAB PM3 28/44QFN
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
PIC18F46J11 FAMILY
9. Module: Master Synchronous Serial Port
10. Module: 10-Bit Analog-to-Digital
DS80435H-page 6
When MSSP1 is used in I
data and clock signals are present on the RC3 and
RC4 pins. The RB4 and RB5 pins, however, may
have extraneous pulses that prevent them from
being used normally.
Work around
The RC3 and RC4 pins retain the correct clock and
data signals, so the device should be connected to
the I
remains cleared, RB5 can be used as a general
purpose output pin under normal firmware control.
This issue applies only to MSSP1 when used in
the I
No work around is necessary if MSSP1 is used in
an SPI mode or if MSSP2 is used.
Affected Silicon Revisions
At high V
forming an A/D conversion on Channel 15 (the
V
the reference voltage supplied to the HLVD
module and comparator module (only when
configured to use the V
At lower V
less or non-existent.
Work around
If precise HLVD or comparator V
are required at high V
forming A/D conversions on Channel 15 while
simultaneously using the HLVD or comparator,
V
Channel 15, a settling time of approximately
100 s is needed before the reference voltage
fully returns to the original value.
Affected Silicon Revisions
BG
IRV
A2
A2
X
X
2
. If an A/D conversion is performed on
absolute reference) can temporarily disturb
2
C mode.
C bus through these pins. If TRISB<5>
A4
A4
X
DD
(MSSP) – Port 1
Converter (A/D) – Band Gap
Reference
DD
voltages (for example, > 2.5V), per-
voltages, the disturbance will be
IRV
DD
).
voltages, avoid per-
2
C mode, the correct
IRV
thresholds
11. Module: Charge Time Measurement Unit
On “F” devices, the CTMU current source will
stop sourcing current if the applied V
falls below the LVDSTAT (WDTCON<6>)
threshold (2.45V nominal). When V
the LVDSTAT threshold, the CTMU will function
normally.
This issue does not apply to “LF” devices. The
current source will continue functioning normally
at all rated voltages for these devices.
Work around
None.
Affected Silicon Revisions
A2
X
A4
(CTMU)
2010 Microchip Technology Inc.
DD
DD
is above
voltage