PIC16CE625-20/P Microchip Technology, PIC16CE625-20/P Datasheet - Page 98

• Manufacturer Part Number: PIC16CE625-20/P
• Description: IC MCU OTP 2KX14 EE COMP 18DIP
• Manufacturer: Microchip Technology
• Series: PIC® 16Cr

Specifications of PIC16CE625-20/P

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Peripherals: Brown-out Detect/Reset, POR, WDT
• Number Of I /o: 13
• Program Memory Size: 3.5KB (2K x 14)
• Program Memory Type: OTP
• Eeprom Size: 128 x 8
• Ram Size: 128 x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 5.5 V
• Oscillator Type: External
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 18-DIP (0.300", 7.62mm)
• For Use With: 309-1059 - ADAPTER 18 ZIF BD W/18SO PLUGSDVA16XP180 - ADAPTER DEVICE FOR MPLAB-ICEAC164010 - MODULE SKT PROMATEII DIP/SOIC
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Data Converters: -
• Connectivity: -

PIC16CE62X
18-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
DS40182C-page 98
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
JEDEC Equivalent: MS-001
Drawing No. C04-007
*Controlling Parameter
Notes:
n
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
E1
E
eB
Dimension Limits
2
1
D
c
Units
A2
eB
A1
E1
B1
A
E
D
B
n
p
L
c
MIN
A1
A
.115
.015
.125
.045
.140
.300
.240
.890
.008
.014
.310
5
5
INCHES*
NOM
.100
.155
.130
.313
.250
.898
.130
.012
.058
.018
.370
18
10
10
B
B1
MAX
.170
.145
.325
.260
.905
.135
.015
.070
.022
.430
15
15
MIN
22.61
3.56
2.92
0.38
7.62
6.10
3.18
0.20
1.14
0.36
7.87
5
5
MILLIMETERS
NOM
p
1999 Microchip Technology Inc.
22.80
2.54
3.94
3.30
7.94
6.35
3.30
0.29
1.46
0.46
9.40
18
10
10
MAX
A2
L
22.99
10.92
4.32
3.68
8.26
6.60
3.43
0.38
1.78
0.56
15
15