PIC16F917-I/P Microchip Technology, PIC16F917-I/P Datasheet - Page 265
PIC16F917-I/P
Manufacturer Part Number
PIC16F917-I/P
Description
IC PIC MCU FLASH 8KX14 40DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F913-ISS.pdf
(330 pages)
3.PIC16F913-ISS.pdf
(8 pages)
4.PIC16F913-ISS.pdf
(34 pages)
5.PIC16F913-ISO.pdf
(274 pages)
Specifications of PIC16F917-I/P
Program Memory Type
FLASH
Program Memory Size
14KB (8K x 14)
Package / Case
40-DIP (0.600", 15.24mm)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LCD, POR, PWM, WDT
Number Of I /o
35
Eeprom Size
256 x 8
Ram Size
352 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
352 B
Interface Type
SSP/I2C/AUSART/SPI
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
35
Number Of Timers
3
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DV164120, DM163029
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DM163029 - BOARD PICDEM FOR MECHATRONICSDVA18XP400 - DEVICE ADAPTER 18F4220 PDIP 40LD444-1001 - DEMO BOARD FOR PICMICRO MCU
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16F917-I/P
Manufacturer:
Microchi
Quantity:
1 278
Company:
Part Number:
PIC16F917-I/P
Manufacturer:
Microchip
Quantity:
960
Company:
Part Number:
PIC16F917-I/PT
Manufacturer:
PIC40
Quantity:
100
Company:
Part Number:
PIC16F917-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
PIC16F917-I/PT
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
- PIC16F616T-ISL PDF datasheet
- PIC16F913-ISS PDF datasheet #2
- PIC16F913-ISS PDF datasheet #3
- PIC16F913-ISS PDF datasheet #4
- PIC16F913-ISO PDF datasheet #5
- Current page: 265 of 330
- Download datasheet (7Mb)
19.6
© 2007 Microchip Technology Inc.
Standard Operating Conditions (unless otherwise stated)
Operating temperature
TH01
TH02
TH03
TH04
TH05
TH06
TH07
Note 1:
Param
No.
2:
3:
Thermal Considerations
θ
θ
T
PD
P
P
P
I
T
Maximum allowable power dissipation is the lower value of either the absolute maximum total power
dissipation or derated power (P
DD
JA
JC
A
J
INTERNAL
I
DER
Symbol
/
O
= Ambient Temperature.
is current to run the chip alone without driving any load on the output pins.
Thermal Resistance
Junction to Ambient
Thermal Resistance
Junction to Case
Junction Temperature
Power Dissipation
Internal Power Dissipation
I/O Power Dissipation
Derated Power
-40°C ≤ T
Characteristic
A
≤ +125°C
DER
).
PIC16F913/914/916/917/946
Typ.
60.0
80.0
90.0
27.5
47.2
46.0
24.4
77.0
31.4
24.0
24.0
20.0
24.7
14.5
20.0
24.4
150
—
—
—
—
Units
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C
W
W
W
W
28-pin PDIP package
28-pin SOIC package
28-pin SSOP package
28-pin QFN 6x6 mm package
40-pin PDIP package
44-pin TQFP package
44-pin QFN 8x8 mm package
64-pin TQFP package
28-pin PDIP package
28-pin SOIC package
28-pin SSOP package
28-pin QFN 6x6 mm package
40-pin PDIP package
44-pin TQFP package
44-pin QFN 8x8 mm package
64-pin TQFP package
For derated power calculations
PD = P
P
(NOTE 1)
P
P
(NOTE 2, 3)
INTERNAL
I
DER
/
O
= Σ (I
= (T
INTERNAL
OL
J
= I
- T
* V
DD
A
Conditions
OL
)/θ
+ P
x V
) + Σ (I
JA
I
DD
/
O
DS41250F-page 263
OH
* (V
DD
- V
OH
))
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