PIC16F917-I/P Microchip Technology, PIC16F917-I/P Datasheet - Page 254

IC PIC MCU FLASH 8KX14 40DIP

PIC16F917-I/P

Manufacturer Part Number
PIC16F917-I/P
Description
IC PIC MCU FLASH 8KX14 40DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr

Specifications of PIC16F917-I/P

Program Memory Type
FLASH
Program Memory Size
14KB (8K x 14)
Package / Case
40-DIP (0.600", 15.24mm)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LCD, POR, PWM, WDT
Number Of I /o
35
Eeprom Size
256 x 8
Ram Size
352 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
352 B
Interface Type
SSP/I2C/AUSART/SPI
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
35
Number Of Timers
3
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DV164120, DM163029
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DM163029 - BOARD PICDEM FOR MECHATRONICSDVA18XP400 - DEVICE ADAPTER 18F4220 PDIP 40LD444-1001 - DEMO BOARD FOR PICMICRO MCU
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

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PIC16F917-I/PT
0
PIC16F91X
40-Lead Plastic Dual In-line (P) – 600 mil Body (PDIP)
DS41250B-page 252
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-011
Drawing No. C04-016
n
eB
E1
E
Dimension Limits
2
1
D
§
c
Units
A2
E1
B1
eB
A1
A
E
D
B
A
n
p
L
c
A1
MIN
2.045
Preliminary
.160
.140
.015
.595
.530
.120
.008
.030
.014
.620
5
5
INCHES*
NOM
40
2.058
.100
.175
.150
.600
.545
.130
.012
.050
.018
.650
10
10
MAX
2.065
.190
.160
.625
.560
.135
.015
.070
.022
.680
B
B1
15
15
MIN
13.46
51.94
15.75
15.11
4.06
3.56
0.38
3.05
0.20
0.76
0.36
5
5
MILLIMETERS
 2004 Microchip Technology Inc.
NOM
40
15.24
13.84
52.26
16.51
2.54
4.45
3.30
0.29
1.27
0.46
3.81
10
10
p
MAX
A2
15.88
14.22
52.45
17.27
4.83
4.06
3.43
0.38
1.78
0.56
L
15
15

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