DSPIC33FJ32MC202-I/SP Microchip Technology, DSPIC33FJ32MC202-I/SP Datasheet - Page 312
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DSPIC33FJ32MC202-I/SP
Manufacturer Part Number
DSPIC33FJ32MC202-I/SP
Description
IC DSPIC MCU/DSP 32K 28DIP
Manufacturer
Microchip Technology
Series
dsPIC™ 33Fr
Datasheets
1.DSPIC33FJ32MC202-IMM.pdf
(320 pages)
2.DSPIC33FJ32MC202-IMM.pdf
(14 pages)
3.DSPIC33FJ32MC202-IMM.pdf
(14 pages)
4.DSPIC33FJ64MC202-ESO.pdf
(424 pages)
Specifications of DSPIC33FJ32MC202-I/SP
Core Processor
dsPIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, DMA, Motor Control PWM, QEI, POR, PWM, WDT
Number Of I /o
21
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 6x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
28-DIP (0.300", 7.62mm)
Core Frequency
40MHz
Core Supply Voltage
2.75V
Embedded Interface Type
I2C, SPI, UART
No. Of I/o's
21
Flash Memory Size
32KB
Supply Voltage Range
3V To 3.6V
Package
28SPDIP
Device Core
dsPIC
Family Name
dSPIC33
Maximum Speed
40 MHz
Operating Supply Voltage
3.3 V
Data Bus Width
16 Bit
Number Of Programmable I/os
21
Interface Type
I2C/SPI/UART
On-chip Adc
6-chx10-bit|6-chx12-bit
Number Of Timers
3
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DV164033 - KIT START EXPLORER 16 MPLAB ICD2DM240001 - BOARD DEMO PIC24/DSPIC33/PIC32
Eeprom Size
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSPIC33FJ32MC202-I/SP
Manufacturer:
Microchip Technology
Quantity:
135
Company:
Part Number:
DSPIC33FJ32MC202-I/SP
Manufacturer:
MICROCHIP
Quantity:
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- DSPIC33FJ32MC202-IMM PDF datasheet
- DSPIC33FJ32MC202-IMM PDF datasheet #2
- DSPIC33FJ32MC202-IMM PDF datasheet #3
- DSPIC33FJ64MC202-ESO PDF datasheet #4
- Current page: 312 of 320
- Download datasheet (5Mb)
dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304
TABLE A-6:
DS70283H-page 312
Section 24.0 “Electrical Characteristics”
Section 25.0 “High Temperature Electrical
Characteristics”
Section 26.0 “Packaging Information”
“Product Identification System”
Section Name
MAJOR SECTION UPDATES (CONTINUED)
Added the 28-pin SSOP Thermal Packaging Characteristics (see
Table
Removed Note 4 from the DC Temperature and Voltage
Specifications (see
Updated the maximum value for parameter DI19 and added
parameters DI28, DI29, DI60a, DI60b, and DI60c to the I/O Pin Input
Specifications (see
Updated Note 3 of the PLL Clock Timing Specifications (see
Table
Removed Note 2 from the AC Characteristics: Internal RC Accuracy
(see
Updated the characteristic description for parameter DI35 in the I/O
Timing Requirements (see
Updated all SPI specifications (see
and
Added Note 4 to the 12-bit mode ADC Module Specifications (see
Table
Added Note 4 to the 10-bit mode ADC Module Specifications (see
Table
Updated all ambient temperature and range values to +150ºC
throughout the chapter.
Updated the storage temperature and range to +160ºC.
Updated the maximum junction temperature from +145ºC to +155ºC.
Updated Note 1 in the PLL Clock Timing Specifications (see
Table
Added Note 3 to the 12-bit Mode ADC Module Specifications (see
Table
Added Note 3 to the 10-bit Mode ADC Module Specifications (see
Table
Added the 28-Lead SSOP package information (see
“Package Marking Information”
Details”).
Added the “SS” definition for the SSOP package.
Figure 24-14
Table
24-3).
24-17).
24-43).
24-44).
25-10).
25-17).
25-18).
24-18).
through
Table
Table
Update Description
24-4).
24-9).
Figure
Table
24-20).
24-21).
and
Table 24-32
© 2011 Microchip Technology Inc.
Section 26.2 “Package
through
Section 26.1
Table 24-39
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