PIC16C56-XTI/P Microchip Technology, PIC16C56-XTI/P Datasheet - Page 69
![IC MCU OTP 1KX12 18DIP](/photos/6/76/67657/18-dip_300mil__sml.jpg)
PIC16C56-XTI/P
Manufacturer Part Number
PIC16C56-XTI/P
Description
IC MCU OTP 1KX12 18DIP
Manufacturer
Microchip Technology
Series
PIC® 16Cr
Datasheet
1.PIC16LC58B-04P.pdf
(194 pages)
Specifications of PIC16C56-XTI/P
Core Processor
PIC
Core Size
8-Bit
Speed
4MHz
Peripherals
POR, WDT
Number Of I /o
12
Program Memory Size
1.5KB (1K x 12)
Program Memory Type
OTP
Ram Size
25 x 8
Voltage - Supply (vcc/vdd)
3 V ~ 6.25 V
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
18-DIP (0.300", 7.62mm)
For Use With
309-1059 - ADAPTER 18 ZIF BD W/18SO PLUGSAC164001 - MODULE SKT PROMATEII 18/28DIP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Data Converters
-
Connectivity
-
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12.0
Absolute Maximum Ratings
Ambient Temperature under bias ..................................................................................................... –55°C to +125°C
Storage Temperature ....................................................................................................................... –65°C to +150°C
Voltage on V
Voltage on MCLR with respect to V
Voltage on all other pins with respect to V
Total power dissipation
Max. current out of V
Max. current into V
Max. current into an input pin (T0CKI only).................................................................................................... ±500 A
Input clamp current, I
Output clamp current, I
Max. output current sunk by any I/O pin ........................................................................................................... 25 mA
Max. output current sourced by any I/O pin ...................................................................................................... 20 mA
Max. output current sourced by a single I/O port (PORTA, B or C) .................................................................. 40 mA
Max. output current sunk by a single I/O port (PORTA, B or C)........................................................................ 50 mA
† NOTICE: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This
is a stress rating only and functional operation of the device at those or any other conditions above those indicated in
the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods
may affect device reliability.
Note 1: Voltage spikes below V
2002 Microchip Technology Inc.
2: Power Dissipation is calculated as follows: Pdis = V
ELECTRICAL CHARACTERISTICS - PIC16C54/55/56/57
Thus, a series resistor of 50 to 100
than pulling this pin directly to V
DD
with respect to V
DD
SS
IK
pin ................................................................................................................................ 100 mA
(2)
OK
(V
pin ............................................................................................................................. 150 mA
............................................................................................................................... 800 mW
I
(V
< 0 or V
O
(†)
< 0 or V
SS
I
SS
..........................................................................................................0V to +7.5V
SS
> V
(1)
O
at the MCLR pin, inducing currents greater than 80 mA, may cause latch-up.
DD
....................................................................................................0V to +14V
> V
SS
) .................................................................................................... ±20 mA
SS
DD
............................................................................–0.6V to (V
.
) ............................................................................................. ±20 mA
should be used when applying a “low” level to the MCLR pin rather
Preliminary
DD
x {I
DD
–
I
OH
} +
{(V
DD
– V
PIC16C5X
OH
) x I
OH
DS30453D-page 67
} + (V
DD
+ 0.6V)
OL
x I
OL
)
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