DSPIC30F1010-30I/SO Microchip Technology, DSPIC30F1010-30I/SO Datasheet - Page 55

IC DSPIC MCU/DSP 6K 28SOIC

DSPIC30F1010-30I/SO

Manufacturer Part Number
DSPIC30F1010-30I/SO
Description
IC DSPIC MCU/DSP 6K 28SOIC
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr

Specifications of DSPIC30F1010-30I/SO

Core Processor
dsPIC
Core Size
16-Bit
Speed
30 MIPs
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
21
Program Memory Size
6KB (2K x 24)
Program Memory Type
FLASH
Ram Size
256 x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 6x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
28-SOIC (7.5mm Width)
Data Bus Width
16 bit
Processor Series
DSPIC30F
Core
dsPIC
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DM240002, DM300023, DM330011
Package
28SOIC W
Device Core
dsPIC
Family Name
dsPIC30
Maximum Speed
30 MHz
Operating Supply Voltage
3.3|5 V
Number Of Programmable I/os
21
Interface Type
I2C/SPI/UART
On-chip Adc
6-chx10-bit
Number Of Timers
2
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DM300023 - KIT DEMO DSPICDEM SMPS BUCKDV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLE
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DSPIC30F1010-30I/SO
Manufacturer:
Microchip Technology
Quantity:
135
Part Number:
DSPIC30F1010-30I/SO
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
Company:
Part Number:
DSPIC30F1010-30I/SO
Quantity:
55
TABLE 12-1:
© 2010 Microchip Technology Inc.
Step 8: Set the read pointer (W6) and load the (next four write) latches.
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
Step 9: Repeat Steps 7-8 eight times to load the write latches for the 32 instructions.
Step 10: Unlock the NVMCON for programming.
0000
0000
0000
0000
Step 11: Initiate the programming cycle.
0000
0000
0000
0000
0000
0000
0000
0000
Step 12: Reset the device internal PC.
0000
0000
Step 13: Repeat Steps 7-12 until all 23 rows of executive memory are programmed.
Command
(Binary)
EB0300
000000
BB0BB6
000000
000000
BBDBB6
000000
000000
BBEBB6
000000
000000
BB1BB6
000000
000000
BB0BB6
000000
000000
BBDBB6
000000
000000
BBEBB6
000000
000000
BB1BB6
000000
000000
200558
883B38
200AA9
883B39
A8E761
000000
000000
000000
000000
A9E761
000000
000000
040100
000000
(Hexadecimal)
PROGRAMMING THE PROGRAMMING EXECUTIVE (CONTINUED)
Data
CLR
NOP
TBLWTL
NOP
NOP
TBLWTH.B
NOP
NOP
TBLWTH.B
NOP
NOP
TBLWTL
NOP
NOP
TBLWTL
NOP
NOP
TBLWTH.B
NOP
NOP
TBLWTH.B
NOP
NOP
TBLWTL
NOP
NOP
MOV
MOV
MOV
MOV
BSET NVMCON, #15
NOP
NOP
Externally time ‘P12a’ ms (see
Timing
NOP
NOP
BCLR NVMCON, #15
NOP
NOP
GOTO 0x100
NOP
Requirements”)
W6
[W6++], [W7]
[W6++], [W7++]
[W6++], [++W7]
[W6++], [W7++]
[W6++], [W7]
[W6++], [W7++]
[W6++], [++W7]
[W6++], [W7++]
#0x55, W8
W8, NVMKEY
#0xAA, W9
W9, NVMKEY
Description
Section 13.0 “AC/DC Characteristics and
DS70102K-page 55

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