DSPIC30F3013-30I/SP Microchip Technology, DSPIC30F3013-30I/SP Datasheet - Page 35
DSPIC30F3013-30I/SP
Manufacturer Part Number
DSPIC30F3013-30I/SP
Description
IC DSPIC MCU/DSP 24K 28DIP
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr
Datasheets
1.DSPIC30F2011-20ISO.pdf
(210 pages)
2.DSPIC30F2011-20ISO.pdf
(6 pages)
3.DSPIC30F3012-20ISO.pdf
(14 pages)
4.DSPIC30F3012-20ISO.pdf
(20 pages)
5.DSPIC30F3014-30IP.pdf
(244 pages)
Specifications of DSPIC30F3013-30I/SP
Program Memory Type
FLASH
Program Memory Size
24KB (8K x 24)
Package / Case
28-DIP (0.300", 7.62mm)
Core Processor
dsPIC
Core Size
16-Bit
Speed
30 MIPs
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
20
Eeprom Size
1K x 8
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 10x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Product
DSCs
Data Bus Width
16 bit
Processor Series
DSPIC30F
Core
dsPIC
Maximum Clock Frequency
30 MHz
Number Of Programmable I/os
30
Data Ram Size
2 KB
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE4000, DM240002, DM300018, DM330011
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLE
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
DSPIC30F301330ISP
- DSPIC30F2011-20ISO PDF datasheet
- DSPIC30F2011-20ISO PDF datasheet #2
- DSPIC30F3012-20ISO PDF datasheet #3
- DSPIC30F3012-20ISO PDF datasheet #4
- DSPIC30F3014-30IP PDF datasheet #5
- Current page: 35 of 210
- Download datasheet (3Mb)
3.2
The core has two data spaces. The data spaces can be
considered
instructions), or as one unified linear address range (for
MCU instructions). The data spaces are accessed
using two Address Generation Units (AGUs) and
separate data paths.
3.2.1
The data space memory is split into two blocks, X and
Y data space. A key element of this architecture is that
Y space is a subset of X space, and is fully contained
within X space. In order to provide an apparent Linear
Addressing space, X and Y spaces have contiguous
addresses.
FIGURE 3-6:
© 2010 Microchip Technology Inc.
Data Address Space
DATA SPACE MEMORY MAP
2 Kbyte
SFR Space
Optionally
Mapped
into Program
Memory
1 Kbyte
SRAM Space
either
dsPIC30F2011/2012 DATA SPACE MEMORY MAP
separate
Address
MSB
0x1FFF
0x0001
0x07FF
0x0801
0x09FF
0x0A01
0x0BFF
0x0C01
0x8001
0xFFFF
(for
dsPIC30F2011/2012/3012/3013
some
MSB
Unimplemented (X)
DSP
Y Data RAM (Y)
X Data RAM (X)
16 bits
SFR Space
X Data
When executing any instruction other than one of the
MAC class of instructions, the X block consists of the 64
Kbyte data address space (including all Y addresses).
When executing one of the MAC class of instructions,
the X block consists of the 64 Kbyte data address
space, excluding the Y address block (for data reads
only). In other words, all other instructions regard the
entire data memory as one composite address space.
The MAC class instructions extract the Y address space
from data space and address it using EAs sourced from
W10 and W11. The remaining X data space is
addressed using W8 and W9. Both address spaces are
concurrently accessed only with the MAC class
instructions.
The data space memory map for the dsPIC30F2011
and dsPIC30F2012 is shown in
space memory map for the dsPIC30F3012 and
dsPIC30F3013 is shown in
LSB
0x0000
0x07FE
0x0800
0x09FE
0x0A00
0x0BFE
0x0C00
0x1FFE
0x8000
0xFFFE
Address
LSB
Figure
Figure
3-7.
8 Kbyte
Near
Data
Space
DS70139G-page 35
3-6. The data
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