DSPIC33FJ32GS406-I/PT Microchip Technology, DSPIC33FJ32GS406-I/PT Datasheet - Page 354
DSPIC33FJ32GS406-I/PT
Manufacturer Part Number
DSPIC33FJ32GS406-I/PT
Description
IC MCU/DSP 32KB FLASH 64TQFP
Manufacturer
Microchip Technology
Series
dsPIC™ 33Fr
Specifications of DSPIC33FJ32GS406-I/PT
Core Processor
dsPIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
I²C, IrDA, LIN, SCI, SPI, UART/USART, USB
Peripherals
Brown-out Detect/Reset, QEI, POR, PWM, WDT
Number Of I /o
58
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-TFQFP
Core Frequency
40MHz
Embedded Interface Type
I2C, SPI, UART
No. Of I/o's
53
Flash Memory Size
32KB
Supply Voltage Range
3V To 3.6V
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSPIC33FJ32GS406-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
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dsPIC33FJ32GS406/606/608/610 and dsPIC33FJ64GS406/606/608/610
27.1
TABLE 27-1:
TABLE 27-2:
TABLE 27-3:
DS70591C-page 354
Industrial Temperature Devices
Extended Temperature Devices
Power Dissipation:
Internal chip power dissipation:
I/O Pin Power Dissipation:
Maximum Allowed Power Dissipation
Package Thermal Resistance, 64-Pin QFN (9x9x0.9 mm)
Package Thermal Resistance, 64-Pin TQFP (10x10x1 mm)
Package Thermal Resistance, 80-Pin TQFP (12x12x1 mm)
Package Thermal Resistance, 100-Pin TQFP (12x12x1 mm)
Package Thermal Resistance, 100-Pin TQFP (14x14x1 mm)
Note 1:
Characteristic
DC Characteristics
P
I/O = ({V
Operating Junction Temperature Range
Operating Ambient Temperature Range
Operating Junction Temperature Range
Operating Ambient Temperature Range
INT
Junction to ambient thermal resistance, Theta-
= V
DD
OPERATING MIPS VS. VOLTAGE
THERMAL OPERATING CONDITIONS
THERMAL PACKAGING CHARACTERISTICS
DD
x (I
– V
V
DD
(in Volts)
DD
3.0-3.6V
3.0-3.6V
OH
Characteristic
– I
Range
} x I
Rating
OH
OH
)
) + (V
OL
x I
OL
-40°C to +125°C
)
Preliminary
-40°C to +85°C
Temp Range
(in °C)
JA
(
JA
) numbers are achieved by package simulations.
Symbol
Symbol
P
DMAX
P
T
T
T
T
JA
JA
JA
JA
JA
A
A
D
J
J
dsPIC33FJ32GS406/606/608/610 and
dsPIC33FJ64GS406/606/608/610
53.1
Min
Typ
-40
-40
-40
-40
28
39
43
43
(T
2010 Microchip Technology Inc.
P
J
INT
– T
Max
Typ
Max MIPS
—
—
—
—
—
—
—
—
—
+ P
A
)/
40
40
I
/
O
JA
°C/W
°C/W
°C/W
°C/W
°C/W
+125
+140
+125
Max
Unit
+85
Notes
Unit
°C
°C
°C
°C
W
W
1
1
1
1
1
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