PIC16C765-I/P Microchip Technology, PIC16C765-I/P Datasheet - Page 154
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PIC16C765-I/P
Manufacturer Part Number
PIC16C765-I/P
Description
IC MCU OTP 8KX14 USB 40DIP
Manufacturer
Microchip Technology
Series
PIC® 16Cr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16C745-ISP.pdf
(165 pages)
3.PIC16C745-ISP.pdf
(6 pages)
4.PIC16C745-ISP.pdf
(6 pages)
Specifications of PIC16C765-I/P
Core Size
8-Bit
Program Memory Size
14KB (8K x 14)
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Core Processor
PIC
Speed
24MHz
Connectivity
SCI, UART/USART, USB
Number Of I /o
33
Program Memory Type
OTP
Ram Size
256 x 8
Voltage - Supply (vcc/vdd)
4.35 V ~ 5.25 V
Data Converters
A/D 8x8b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
40-DIP (0.600", 15.24mm)
Controller Family/series
PIC16C
No. Of I/o's
33
Ram Memory Size
256Byte
Cpu Speed
24MHz
No. Of Timers
3
Processor Series
PIC16C
Core
PIC
Data Bus Width
8 bit
Data Ram Size
256 B
Maximum Clock Frequency
24 MHz
Number Of Programmable I/os
33
Number Of Timers
3
Operating Supply Voltage
4.35 V to 5.25 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
ICE2000, DM163022
Minimum Operating Temperature
- 40 C
On-chip Adc
5 bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
ISPICR1 - ADAPTER IN-CIRCUIT PROGRAMMING444-1001 - DEMO BOARD FOR PICMICRO MCU
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Other names
Q975613
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16C765-I/P
Manufacturer:
MICROCHIP
Quantity:
12 000
Company:
Part Number:
PIC16C765-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
PIC16C745/765
44-Lead Plastic Thin Quad Flatpack (PT) 10x10x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
DS41124C-page 154
Number of Pins
Pitch
Pins per Side
Overall Height
Molded Package Thickness
Standoff §
Foot Length
Footprint (Reference)
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Pin 1 Corner Chamfer
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-026
Drawing No. C04-076
B
c
p
#leads=n1
Dimension Limits
E1
E
Units
CH
A2
(F)
D1
n1
A1
E1
A
E
D
B
n
p
L
c
n
MIN
Preliminary
2
1
.039
.037
.002
.018
.463
.463
.390
.390
.004
.012
.025
D1
0
5
5
L
CH x 45
INCHES
D
NOM
A1
.043
.039
.004
.024
.039
.472
.472
.394
.394
.006
.015
.035
.031
3.5
44
10
10
11
A
MAX
.047
.006
.030
.398
.398
.008
.017
.045
.482
.482
.041
15
15
7
(F)
MIN
11.75
11.75
1.00
0.95
0.05
0.45
1.00
9.90
9.90
0.09
0.30
0.64
0
5
5
MILLIMETERS*
NOM
2000 Microchip Technology Inc.
12.00
12.00
10.00
10.00
0.80
1.10
1.00
0.10
0.60
0.15
0.38
0.89
3.5
44
10
10
11
A2
MAX
12.25
12.25
10.10
10.10
1.20
1.05
0.15
0.75
0.20
0.44
1.14
15
15
7