DSPIC30F3011-30I/PT Microchip Technology, DSPIC30F3011-30I/PT Datasheet - Page 232

• Manufacturer Part Number: DSPIC30F3011-30I/PT
• Description: IC DSPIC MCU/DSP 24K 44TQFP
• Manufacturer: Microchip Technology
• Series: dsPIC™ 30Fr

Specifications of DSPIC30F3011-30I/PT

• Program Memory Type: FLASH
• Program Memory Size: 24KB (8K x 24)
• Package / Case: 44-TQFP, 44-VQFP
• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 30 MIPs
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, Motor Control PWM, QEI, POR, PWM, WDT
• Number Of I /o: 30
• Eeprom Size: 1K x 8
• Ram Size: 1K x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 5.5 V
• Data Converters: A/D 9x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Product: DSCs
• Data Bus Width: 16 bit
• Processor Series: DSPIC30F
• Core: dsPIC
• Maximum Clock Frequency: 30 MHz
• Data Ram Size: 1024 B
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE4000, DM240002, DM330011, DM300018
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT80PT3 - SOCKET TRAN ICE 80MQFP/TQFPAC30F006 - MODULE SKT FOR DSPIC30F 44TQFPAC164305 - MODULE SKT FOR PM3 44TQFPDV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLE
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: DSPIC30F301130IPT

dsPIC30F
64-Lead Plastic Thin Quad Flatpack 14x14x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
DS70082G-page 230
B
c
Number of Pins
Pitch
Pins per Side
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
JEDEC Equivalent: MS-026
Drawing No. C04-066
β
*Controlling Parameter
Notes:
p
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed .010" (0.254mm) per side.
Dimension Limits
#leads=n1
E1
E
Units
A2
D1
n1
(F)
E1
A1
α
D
B
β
n
p
A
c
L
φ
E
n
MIN
.004
.037
.002
.018
.012
Preliminary
11
11
2
1
φ
0
INCHES
D1
L
.039 REF
.630 BSC
.630 BSC
.551 BSC
.551 BSC
NOM
.031
64
16
D
.024
.015
.039
3.5
12
12
A
A1
MAX
.047
.006
.030
.008
.018
.041
13
13
(F)
7
MIN
0.95
0.05
0.45
0.30
0.09
11
11
0
MILLIMETERS*
 2004 Microchip Technology Inc.
16.00 BSC
16.00 BSC
14.00 BSC
14.00 BSC
1.00 REF
NOM
0.80
16
64
1.00
0.60
0.37
3.5
12
12
MAX
A2
1.20
1.05
0.15
0.75
0.20
0.45
13
13
7
α