PIC16F76-I/SP Microchip Technology, PIC16F76-I/SP Datasheet - Page 141
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PIC16F76-I/SP
Manufacturer Part Number
PIC16F76-I/SP
Description
IC MCU FLASH 8KX14 A/D 28DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F688T-ISL.pdf
(688 pages)
3.PIC16F818-ISO.pdf
(6 pages)
4.PIC16F73-ISP.pdf
(174 pages)
5.PIC16F73-ISP.pdf
(14 pages)
6.PIC16F73-ISP.pdf
(12 pages)
Specifications of PIC16F76-I/SP
Program Memory Type
FLASH
Program Memory Size
14KB (8K x 14)
Package / Case
28-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
22
Ram Size
368 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Data Converters
A/D 5x8b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
368 B
Interface Type
I2C/SPI/USART
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
22
Number Of Timers
3
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
ICE2000, DM163022
Minimum Operating Temperature
- 40 C
On-chip Adc
5-ch x 8-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16F76-I/SP
Manufacturer:
MICROCHIP
Quantity:
10 000
Company:
Part Number:
PIC16F76-I/SP
Manufacturer:
MICROCHIP
Quantity:
53
Part Number:
PIC16F76-I/SP
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
FIGURE 15-19:
TABLE 15-13: A/D CONVERSION REQUIREMENTS
2002 Microchip Technology Inc.
Note 1: ADRES register may be read on the following T
Param
130
131
132
134
No.
Note 1: If the A/D clock source is selected as RC, a time of T
A/D DATA
*
† Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance
2: See Section 11.1 for minimum conditions.
SAMPLE
A/D CLK
ADRES
T
T
T
T
Sym
BSF ADCON0, GO
AD
CNV
ACQ
GO
These parameters are characterized but not tested.
only and are not tested.
ADIF
GO
Q4
to be executed.
A/D clock period
Conversion time (not including
S/H time) (Note 1)
Acquisition time
Q4 to A/D clock start
134
132
Characteristic
A/D CONVERSION TIMING
(T
OSC
/2)
7
(1)
PIC16F7X
PIC16LF7X
PIC16F7X
PIC16LF7X
6
OLD_DATA
5
CY
SAMPLING STOPPED
is added before the A/D clock starts. This allows the SLEEP instruction
CY
Min
1.6
2.0
2.0
3.0
5*
—
9
4
cycle.
131
130
T
Typ†
OSC
3
4.0
6.0
—
—
—
—
/2
2
Max
6.0
9.0
—
—
—
—
9
1
Units
T
µs
µs
µs
µs
µs
—
AD
1 T
0
T
T
2.0V ≤ V
A/D RC mode
A/D RC mode
The minimum time is the
amplifier settling time. This
may be used if the “new” input
voltage has not changed by
more than 1 LSb (i.e.,
20.0 mV @ 5.12V) from the
last sampled voltage (as
stated on C
If the A/D clock source is
selected as RC, a time of T
is added before the A/D clock
starts. This allows the SLEEP
instruction to be executed.
OSC
OSC
CY
PIC16F7X
based, V
based,
NEW_DATA
DONE
REF
Conditions
DS30325B-page 139
HOLD
≤ 5.5V
REF
).
≥ 3.0V
CY