PIC24HJ64GP206-I/PT Microchip Technology, PIC24HJ64GP206-I/PT Datasheet - Page 242

• Manufacturer Part Number: PIC24HJ64GP206-I/PT
• Description: IC PIC MCU FLASH 32KX16 64TQFP
• Manufacturer: Microchip Technology
• Series: PIC® 24Hr

Specifications of PIC24HJ64GP206-I/PT

• Program Memory Type: FLASH
• Program Memory Size: 64KB (22K x 24)
• Package / Case: 64-TFQFP
• Core Processor: PIC
• Core Size: 16-Bit
• Speed: 40 MIPs
• Connectivity: I²C, IrDA, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number Of I /o: 53
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 18x10b/12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC24HJ
• Core: PIC
• Data Bus Width: 16 bit
• Data Ram Size: 8 KB
• Interface Type: CAN, I2C, SPI, UART
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 53
• Number Of Timers: 13
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 12 bit, 18 Channel
• Controller Family/series: PIC24
• No. Of I/o's: 53
• Ram Memory Size: 8KB
• Cpu Speed: 40MIPS
• No. Of Timers: 13
• Embedded Interface Type: I2C, SPI, UART
• Rohs Compliant: Yes
• Height: 1 mm
• Length: 10 mm
• Supply Voltage (max): 3.6 V
• Supply Voltage (min): 3 V
• Width: 10 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 876-1004 - PIC24 BREAKOUT BOARDDM300024 - KIT DEMO DSPICDEM 1.1MA240012 - MODULE PLUG-IN PIC24H 100QFPDV164033 - KIT START EXPLORER 16 MPLAB ICD2DM300019 - BOARD DEMO DSPICDEM 80L STARTERDM240001 - BOARD DEMO PIC24/DSPIC33/PIC32AC164327 - MODULE SKT FOR 64TQFP
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PIC24H
23.1
TABLE 23-1:
TABLE 23-2:
TABLE 23-3:
TABLE 23-4:
DS70175C-page 240
DC CHARACTERISTICS
Operating Voltage
DC10
DC12
DC16
DC17
Note 1:
Characteristic
DC5
PIC24H
Power Dissipation:
Internal chip power dissipation:
I/O Pin Power Dissipation:
Maximum Allowed Power Dissipation
Package Thermal Resistance, 100-pin TQFP (14x14x1 mm)
Package Thermal Resistance, 100-pin TQFP (12x12x1 mm)
Package Thermal Resistance, 80-pin TQFP (12x12x1 mm)
Package Thermal Resistance, 64-pin TQFP (10x10x1 mm)
Legend: TBD = To Be Determined
Note 1:
Param
No.
2:
Operating Junction Temperature Range
DC Characteristics
P
I/O =
Operating Ambient Temperature Range
Supply Voltage
V
V
V
S
Symbol
INT
DD
DR
POR
VDD
Data in “Typ” column is at 3.3V, 25°C unless otherwise stated. Parameters are for design guidance only
and are not tested.
This is the limit to which V
Junction to ambient thermal resistance, Theta-
= V
({V
DD
OPERATING MIPS VS. VOLTAGE
THERMAL OPERATING CONDITIONS
THERMAL PACKAGING CHARACTERISTICS
DC TEMPERATURE AND VOLTAGE SPECIFICATIONS
RAM Data Retention Voltage
V
to ensure internal
Power-on Reset signal
V
to ensure internal
Power-on Reset signal
DD
x (I
DD
DD
– V
V
DD
Start Voltage
Rise Rate
(in Volts)
DD
3.0-3.6V
OH
Characteristic
–
Range
Characteristic
} x I
Rating
I
OH
OH
)
) +
DD
(V
can be lowered without losing RAM data.
OL
x I
OL
(2)
)
Preliminary
-40°C to +85°C
Temp Range
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature
(in °C)
0.05
Min
3.0
—
—
JA
(
JA
) numbers are achieved by package simulations.
Typ
V
2.8
—
—
SS
Symbol
Symbol
P
(1)
DMAX
P
T
T
JA
JA
JA
JA
A
D
J
Max
3.6
—
—
—
-40°C T
48.4
52.3
38.7
38.3
Min
Typ
-40
-40
Units
V/ms 0-3.3V in 0.1s
V
V
V
(T
© 2006 Microchip Technology Inc.
P
A
J
INT
– T
Max
Typ
0-2.5V in 60 ms
Max MIPS
—
—
—
—
—
—
+ P
PIC24H
+85°C for Industrial
A
)/
40
I
/
O
JA
Conditions
°C/W
°C/W
°C/W
°C/W
+125
Max
Unit
+85
Notes
Unit
°C
°C
W
W
1
1
1
1