DSPIC33FJ128GP202-I/MM Microchip Technology, DSPIC33FJ128GP202-I/MM Datasheet - Page 342
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DSPIC33FJ128GP202-I/MM
Manufacturer Part Number
DSPIC33FJ128GP202-I/MM
Description
IC DSPIC MCU/DSP 128K 28-QFN
Manufacturer
Microchip Technology
Series
dsPIC™ 33Fr
Datasheets
1.DSPIC33FJ32GP204-IPT.pdf
(14 pages)
2.DSPIC33FJ32GP302-ISO.pdf
(412 pages)
3.DSPIC33FJ64GP804-IML.pdf
(402 pages)
Specifications of DSPIC33FJ128GP202-I/MM
Program Memory Type
FLASH
Program Memory Size
128KB (128K x 8)
Package / Case
28-QFN
Core Processor
dsPIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
AC'97, Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number Of I /o
21
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 10x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Product
DSCs
Data Bus Width
16 bit
Processor Series
DSPIC33F
Core
dsPIC
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
21
Data Ram Size
8 KB
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DM240001, DV164033
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DV164033 - KIT START EXPLORER 16 MPLAB ICD2DM240001 - BOARD DEMO PIC24/DSPIC33/PIC32
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
- DSPIC33FJ32GP204-IPT PDF datasheet
- DSPIC33FJ32GP302-ISO PDF datasheet #2
- DSPIC33FJ64GP804-IML PDF datasheet #3
- Current page: 342 of 402
- Download datasheet (3Mb)
dsPIC33FJ32GP302/304, dsPIC33FJ64GPX02/X04, AND dsPIC33FJ128GPX02/X04
FIGURE 30-11:
TABLE 30-30: SPIx MODULE SLAVE MODE (CKE = 0) TIMING REQUIREMENTS
DS70292D-page 342
AC CHARACTERISTICS
SP70
SP71
SP72
SP73
SP30
SP31
SP35
SP40
SP41
SP50
SP51
SP52
Note 1:
Param
No.
Note: Refer to Figure 30-1 for load conditions.
2:
3:
SCK
(CKP = 0)
(CKP = 1)
SDO
SS
SCK
SDI
TscF
TscR
TdoF
TdoR
TscH2doV,
TscL2doV
TdiV2scH,
TdiV2scL
TscH2diL,
TscL2diL
TssL2scH,
TssL2scL
TssH2doZ SSx to SDOx Output
TscL
TscH
X
TscH2ssH
TscL2ssH
X
Symbol
X
X
These parameters are characterized but not tested in manufacturing.
Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.
Assumes 50 pF load on all SPIx pins.
X
SCKx Input Low Time
SCKx Input High Time
SCKx Input Fall Time
SCKx Input Rise Time
SDOx Data Output Fall Time
SDOx Data Output Rise Time
SDOx Data Output Valid after
SCKx Edge
Setup Time of SDIx Data Input
to SCKx Edge
Hold Time of SDIx Data Input
to SCKx Edge
SSx to SCKx or SCKx Input
High-Impedance
SSx after SCKx Edge
SPIx MODULE SLAVE MODE (CKE = 0) TIMING CHARACTERISTICS
SP50
Characteristic
SP35
SP71
SP40
(3)
MSb In
MSb
SP41
SP70
(3)
(3)
(1)
SP30,SP31
Preliminary
(3)
(3)
1.5 T
Bit 14 - - - -1
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature
Bit 14 - - - - - -1
Min
120
CY
30
30
20
20
10
—
—
—
—
—
+ 40
SP73
SP72
Typ
—
—
10
10
—
—
—
—
—
—
—
—
(2)
SP72
SP73
LSb
LSb In
Max
25
25
30
50
—
—
—
—
—
—
—
—
-40°C T
-40°C T
SP52
2009 Microchip Technology Inc.
Units
SP51
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
A
A
+85°C for Industrial
+125°C for Extended
See Note 3
See Note 3
See parameter D032
and Note 3
See parameter D031
and Note 3
See Note 3
Conditions
—
—
—
—
—
—
—
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