PIC16F84-10/SO Microchip Technology, PIC16F84-10/SO Datasheet - Page 103

IC MCU FLASH 1KX14 EE 18SOIC

PIC16F84-10/SO

Manufacturer Part Number
PIC16F84-10/SO
Description
IC MCU FLASH 1KX14 EE 18SOIC
Manufacturer
Microchip Technology
Series
PIC® 16Fr

Specifications of PIC16F84-10/SO

Core Size
8-Bit
Program Memory Size
1.75KB (1K x 14)
Core Processor
PIC
Speed
10MHz
Peripherals
POR, WDT
Number Of I /o
13
Program Memory Type
FLASH
Eeprom Size
64 x 8
Ram Size
68 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 6 V
Oscillator Type
External
Operating Temperature
0°C ~ 70°C
Package / Case
18-SOIC (7.5mm Width)
Controller Family/series
PIC16F
No. Of I/o's
13
Eeprom Memory Size
64Byte
Ram Memory Size
68Byte
Cpu Speed
10MHz
No. Of Timers
1
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT18SO-1 - SOCKET TRANSITION 18SOIC 300MIL309-1075 - ADAPTER 18-SOIC TO 18-SOIC309-1011 - ADAPTER 18-SOIC TO 18-DIP309-1010 - ADAPTER 18-SOIC TO 18-DIPAC164010 - MODULE SKT PROMATEII DIP/SOIC
Data Converters
-
Connectivity
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC16F84-10/SO
Manufacturer:
AD
Quantity:
34
Part Number:
PIC16F84-10/SO
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
6.3.3
1997 Microchip Technology Inc.
Banking
The data memory is partitioned into four banks. Each bank contains General Purpose Registers
and Special Function Registers. Switching between these banks requires the RP0 and RP1 bits
in the STATUS register to be configured for the desired bank when using direct addressing. The
IRP bit in the STATUS register is used for indirect addressing.
Table 6-1:
Each Bank extends up to 7Fh (128 bytes). The lower locations of each bank are reserved for the
Special Function Registers. Above the Special Function Registers are General Purpose Regis-
ters. All data memory is implemented as static RAM. All Banks may contain special function reg-
isters. Some “high use” special function registers from Bank0 are mirrored in the other banks for
code reduction and quicker access.
Through the evolution of the products, there are a few variations in the layout of the Data Memory.
The data memory organization that will be the standard for all new devices is shown in
Figure
reduce the software overhead for context switching. The registers in bold will be in every device.
The other registers are peripheral dependent. Not every peripheral’s registers are shown,
because some file addresses have a different registers from those shown. As with all the figures,
tables, and specifications presented in this reference guide, verify the details with the device spe-
cific data sheet.
Figure 6-4: Direct Addressing
Accessed
Bank
RP1 RP0
bank select
0
1
2
3
6-5. This Memory map has the last 16-bytes mapped across all memory banks. This is to
Section 6. Memory Organization
Direct and Indirect Addressing of Banks
(RP1:RP0)
Direct
location select
6
Direct Addressing
0 0
0 1
1 0
1 1
Data
Memory
from opcode
Indirect
(IRP)
7Fh
00h
0
1
Bank0
00
0
Bank1
01
Bank2
10
Bank3
11
DS31006A-page 6-9
7Fh
6

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