PIC24HJ128GP502-I/MM Microchip Technology, PIC24HJ128GP502-I/MM Datasheet - Page 284
![IC PIC MCU FLASH 128K 28QFN-S](/photos/6/81/68120/150-28-qfn_sml.jpg)
PIC24HJ128GP502-I/MM
Manufacturer Part Number
PIC24HJ128GP502-I/MM
Description
IC PIC MCU FLASH 128K 28QFN-S
Manufacturer
Microchip Technology
Series
PIC® 24Hr
Datasheets
1.PIC24HJ12GP201-ISO.pdf
(84 pages)
2.PIC24HJ32GP302-ISO.pdf
(368 pages)
3.PIC24HJ32GP302-ISO.pdf
(8 pages)
4.PIC24HJ32GP302-ISO.pdf
(12 pages)
5.PIC24HJ32GP304-EML.pdf
(356 pages)
Specifications of PIC24HJ128GP502-I/MM
Program Memory Type
FLASH
Program Memory Size
128KB (43K x 24)
Package / Case
28-QFN
Core Processor
PIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
CAN, I²C, IrDA, LIN, PMP, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number Of I /o
21
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 10x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC24HJ
Core
PIC
Data Bus Width
16 bit
Data Ram Size
8 KB
Interface Type
I2C/SPI/UART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
21
Number Of Timers
5
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DM300027
Minimum Operating Temperature
- 40 C
On-chip Adc
10-ch x 12-bit
Controller Family/series
PIC24
No. Of I/o's
21
Ram Memory Size
8KB
Cpu Speed
40MIPS
No. Of Timers
7
Embedded Interface Type
CAN, I2C, SPI, UART
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC164322 - MODULE SOCKET MPLAB PM3 28/44QFN
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC24HJ128GP502-I/MM
Manufacturer:
MAXIM
Quantity:
101
- PIC24HJ12GP201-ISO PDF datasheet
- PIC24HJ32GP302-ISO PDF datasheet #2
- PIC24HJ32GP302-ISO PDF datasheet #3
- PIC24HJ32GP302-ISO PDF datasheet #4
- PIC24HJ32GP304-EML PDF datasheet #5
- Current page: 284 of 356
- Download datasheet (6Mb)
28.1
TABLE 28-1:
TABLE 28-2:
TABLE 28-3:
DS70293D-page 284
Characteristic
Industrial Temperature Devices
Extended Temperature Devices
Power Dissipation:
Internal chip power dissipation:
I/O Pin Power Dissipation:
Maximum Allowed Power Dissipation
Package Thermal Resistance, 44-pin QFN
Package Thermal Resistance, 44-pin TFQP
Package Thermal Resistance, 28-pin SPDIP
Package Thermal Resistance, 28-pin SOIC
Package Thermal Resistance, 28-pin QFN-S
Note 1:
I/O =
DC Characteristics
P
Operating Junction Temperature Range
Operating Ambient Temperature Range
Operating Junction Temperature Range
Operating Ambient Temperature Range
INT
Junction to ambient thermal resistance, Theta-
= V
({V
DD
OPERATING MIPS VS. VOLTAGE
THERMAL OPERATING CONDITIONS
THERMAL PACKAGING CHARACTERISTICS
DD
x (I
– V
V
DD
(in Volts)
DD
3.0-3.6V
3.0-3.6V
OH
Characteristic
–
Range
} x I
Rating
I
OH
OH
)
) +
(V
OL
x I
OL
-40°C to +125°C
)
Preliminary
-40°C to +85°C
Temp Range
(in °C)
JA
(
JA
) numbers are achieved by package simulations.
Symbol
Symbol
P
DMAX
P
T
T
T
T
JA
JA
JA
JA
JA
A
A
D
J
J
Min
Typ
-40
-40
-40
-40
30
40
45
50
30
PIC24HJ64GPX02/X04 and
PIC24HJ128GPX02/X04
PIC24HJ32GP302/304,
(T
P
© 2009 Microchip Technology Inc.
INT
J
– T
Max
Typ
Max MIPS
—
—
—
—
—
—
—
—
—
+ P
A
)/
40
40
I
/
O
JA
°C/W
°C/W
°C/W
°C/W
°C/W
+125
+140
+125
Max
Unit
+85
Notes
Unit
°C
°C
°C
°C
W
W
1
1
1
1
1
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