PIC16F84-04I/P Microchip Technology, PIC16F84-04I/P Datasheet - Page 109
![IC MCU FLASH 1KX14 EE 18DIP](/photos/6/76/67657/18-dip_300mil__sml.jpg)
PIC16F84-04I/P
Manufacturer Part Number
PIC16F84-04I/P
Description
IC MCU FLASH 1KX14 EE 18DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F688T-ISL.pdf
(688 pages)
2.PIC16LF84A-04P.pdf
(125 pages)
3.PIC16LF84A-04P.pdf
(4 pages)
Specifications of PIC16F84-04I/P
Core Size
8-Bit
Program Memory Size
1.75KB (1K x 14)
Core Processor
PIC
Speed
4MHz
Peripherals
POR, WDT
Number Of I /o
13
Program Memory Type
FLASH
Eeprom Size
64 x 8
Ram Size
68 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 6 V
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
18-DIP (0.300", 7.62mm)
Controller Family/series
PIC16F
No. Of I/o's
13
Eeprom Memory Size
64Byte
Ram Memory Size
68Byte
Cpu Speed
4MHz
No. Of Timers
1
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
68 B
Maximum Clock Frequency
4 MHz
Number Of Programmable I/os
13
Number Of Timers
1
Operating Supply Voltage
2 V to 6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
ICE2000
Minimum Operating Temperature
- 40 C
Data Rom Size
64 B
Height
3.3 mm
Length
22.86 mm
Supply Voltage (max)
6 V
Supply Voltage (min)
2 V
Width
6.35 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DVA16XP180 - ADAPTER DEVICE FOR MPLAB-ICEAC164010 - MODULE SKT PROMATEII DIP/SOIC
Data Converters
-
Connectivity
-
Lead Free Status / Rohs Status
Details
- Current page: 109 of 688
- Download datasheet (3Mb)
1997 Microchip Technology Inc.
Example 6-4: RAM Initialization
Bank0_LP
;
; Next Bank (Bank1)
; (** ONLY REQUIRED IF DEVICE HAS A BANK1 **)
;
Bank1_LP
;
; Next Bank (Bank2)
; (** ONLY REQUIRED IF DEVICE HAS A BANK2 **)
;
Bank2_LP
;
; Next Bank (Bank3)
; (** ONLY REQUIRED IF DEVICE HAS A BANK3 **)
;
Bank3_LP
:
CLRF
MOVLW
MOVWF
CLRF
INCF
BTFSS
GOTO
MOVLW
MOVWF
CLRF
INCF
BTFSS
GOTO
BSF
MOVLW
MOVWF
CLRF
INCF
BTFSS
GOTO
MOVLW
MOVWF
CLRF
INCF
BTFSS
GOTO
Section 6. Memory Organization
STATUS
0x20
FSR
INDF0
FSR
FSR, 7
Bank0_LP
0xA0
FSR
INDF0
FSR
STATUS, C
Bank1_LP
STATUS, IRP
0x20
FSR
INDF0
FSR
FSR, 7
Bank2_LP
0xA0
FSR
INDF0
FSR
STATUS, C
Bank3_LP
; Clear STATUS register (Bank0)
; 1st address (in bank) of GPR area
; Move it to Indirect address register
; Clear GPR at address pointed to by FSR
; Next GPR (RAM) address
; End of current bank ? (FSR = 80h, C = 0)
; NO, clear next location
; 1st address (in bank) of GPR area
; Move it to Indirect address register
; Clear GPR at address pointed to by FSR
; Next GPR (RAM) address
; End of current bank? (FSR = 00h, C = 1)
; NO, clear next location
; Select Bank2 and Bank3
;
; 1st address (in bank) of GPR area
; Move it to Indirect address register
; Clear GPR at address pointed to by FSR
; Next GPR (RAM) address
; End of current bank? (FSR = 80h, C = 0)
; NO, clear next location
; 1st address (in bank) of GPR area
; Move it to Indirect address register
; Clear GPR at address pointed to by FSR
; Next GPR (RAM) address
; End of current bank? (FSR = 00h, C = 1)
; NO, clear next location
; YES, All GPRs (RAM) is cleared
for Indirect addressing
DS31006A-page 6-15
6
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