PIC16F777-I/P Microchip Technology, PIC16F777-I/P Datasheet - Page 428
PIC16F777-I/P
Manufacturer Part Number
PIC16F777-I/P
Description
IC PIC MCU FLASH 8KX14 40DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F688T-ISL.pdf
(688 pages)
3.PIC16F737-ISP.pdf
(276 pages)
4.PIC16F737-ISP.pdf
(10 pages)
Specifications of PIC16F777-I/P
Program Memory Type
FLASH
Program Memory Size
14KB (8K x 14)
Package / Case
40-DIP (0.600", 15.24mm)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
36
Ram Size
368 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Data Converters
A/D 14x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
368 B
Interface Type
AUSART/CCP/I2C/MSSP/SPI
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
36
Number Of Timers
3
Operating Supply Voltage
4 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
ICE2000, DM163022
Minimum Operating Temperature
- 40 C
On-chip Adc
14-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
I3DBF777 - BOARD DAUGHTER ICEPIC3DVA18XP400 - DEVICE ADAPTER 18F4220 PDIP 40LD444-1001 - DEMO BOARD FOR PICMICRO MCU
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
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Manufacturer
Quantity
Price
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Part Number:
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Manufacturer:
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Quantity:
5 510
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- PIC16F616T-ISL PDF datasheet
- PIC16F688T-ISL PDF datasheet #2
- PIC16F737-ISP PDF datasheet #3
- PIC16F737-ISP PDF datasheet #4
- Current page: 428 of 688
- Download datasheet (3Mb)
PICmicro MID-RANGE MCU FAMILY
23.4
DS31023A-page 23-6
A/D Acquisition Requirements
For the A/D converter to meet its specified accuracy, the charge holding capacitor (C
be allowed to fully charge to the input channel voltage level. The analog input model is shown in
Figure
directly affect the time required to charge the capacitor C
ance varies over the device voltage (V
ance for analog sources is 10 k . As the impedance is decreased, the acquisition time may be
decreased. After the analog input channel is selected (changed) this acquisition must be done
before the conversion can be started.
To calculate the minimum acquisition time,
that 1/2 LSb error is used (1024 steps for the A/D). The 1/2 LSb error is the maximum error
allowed for the A/D to meet its specified resolution.
Equation 23-1:
Equation 23-2:
Example 23-1
This calculation is based on the following application system assumptions.
C
Rs
Conversion Error
V
Temperature
V
Example 23-1:
T
T
Temperature coefficient is only required for temperatures > 25 C.
T
T
T
DD
HOLD
HOLD
V
or
Tc
ACQ
ACQ
ACQ
C
ACQ
HOLD
=
=
23-3. The source impedance (R
=
=
=
=
Amplifier Settling Time +
Holding Capacitor Charging Time +
Temperature Coefficient
T
=
=
T
2 s + Tc + [(Temp - 25 C)(0.05 s/ C)]
-C
-120 pF (1 k + 7 k + 10 k ) ln(0.0004885)
-120 pF (18 k ) ln(0.0004885)
-2.16 s (-7.6241)
16.47 s
2 s + 16.47 s + [(50 C - 25 C)(0.05 s/ C)]
18.47 s + 1.25 s
19.72 s
shows the calculation of the minimum required acquisition time T
AMP
AMP
HOLD
Acquisition Time
A/D Minimum Charging Time
(V
-(120 pF)(1 k + R
Calculating the Minimum Required Acquisition Time (Case 1)
+ T
+ T
REF
(R
=
=
=
=
=
C
C
- (V
IC
+ T
+ T
+ R
Preliminary
120 pF
10 k
1/2 LSb
5V
50 C (system max.)
0V @ time = 0
REF
COFF
COFF
SS
/2048)) • (1 - e
+ R
Rss = 7 k
SS
S
DD
) ln(1/2047)
S
+ R
),
) and the internal sampling switch (R
Equation 23-1
Figure
S
) ln(1/2047)
(-Tc/C
23-3. The maximum recommended imped-
(see graph in
HOLD
HOLD
may be used. This equation assumes
(R
IC
. The sampling switch (R
+ R
SS
Figure
1997 Microchip Technology Inc.
+ R
S
))
)
23-3)
ACQ
SS
) impedance
.
HOLD
SS
) imped-
) must
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