PIC16F876-04/SO Microchip Technology, PIC16F876-04/SO Datasheet - Page 21
PIC16F876-04/SO
Manufacturer Part Number
PIC16F876-04/SO
Description
IC MCU FLASH 8KX14 EE 28SOIC
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F688T-ISL.pdf
(688 pages)
3.PIC16C770-ISO.pdf
(8 pages)
4.PIC16F873-04SO.pdf
(218 pages)
5.PIC16F873-04SO.pdf
(5 pages)
6.PIC16F873-04SO.pdf
(5 pages)
Specifications of PIC16F876-04/SO
Core Size
8-Bit
Program Memory Size
14KB (8K x 14)
Core Processor
PIC
Speed
4MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
22
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
368 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Data Converters
A/D 5x10b
Oscillator Type
External
Operating Temperature
0°C ~ 70°C
Package / Case
28-SOIC (7.5mm Width)
Controller Family/series
PIC16F
No. Of I/o's
22
Eeprom Memory Size
256Byte
Ram Memory Size
368Byte
Cpu Speed
4MHz
No. Of Timers
3
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
368 B
Interface Type
MSSP, PSP, USART
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
22
Number Of Timers
3 bit
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 70 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163022, DV164120
Minimum Operating Temperature
0 C
On-chip Adc
5 bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT28SO-1 - SOCKET TRANSITION 28SOIC 300MIL309-1073 - ADAPTER 28-SOIC TO 28-SOIC309-1024 - ADAPTER 28-SOIC TO 28-DIP309-1023 - ADAPTER 28-SOIC TO 28-DIP
Lead Free Status / Rohs Status
Details
- PIC16F616T-ISL PDF datasheet
- PIC16F688T-ISL PDF datasheet #2
- PIC16C770-ISO PDF datasheet #3
- PIC16F873-04SO PDF datasheet #4
- PIC16F873-04SO PDF datasheet #5
- PIC16F873-04SO PDF datasheet #6
- Current page: 21 of 688
- Download datasheet (3Mb)
1.5.3
1997 Microchip Technology Inc.
Packaging Varieties
Depending on the development phase of your project, one of three package types would be used:
The first is a device with an erasure window. Typically these are found in packages with a ceramic
body. These devices are used for the development phase, since the device’s program memory
can be erased and reprogrammed many times.
The second package type is a low cost plastic package. This package type is used in production
where device cost is to be kept to a minimum.
Lastly, there is the DIE option. A DIE is an unpackaged device that has been tested. DIEs are
used in low cost designs and designs where board space is at a minimum.
quick summary of this.
Table 1-3:
Windowed
Plastic
DIE
Package Type
Typical Package Uses
Typical Usage
Development Mode
Production
Special Applications, such as those which require minimum board space
Section 1. Introduction
Table 1-3
DS31001A-page 1-9
shows a
1
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