PIC16F876-04/SP Microchip Technology, PIC16F876-04/SP Datasheet - Page 95
![IC MCU FLASH 8KX14 EE 28DIP](/photos/6/59/65908/150-28-dip_sml.jpg)
PIC16F876-04/SP
Manufacturer Part Number
PIC16F876-04/SP
Description
IC MCU FLASH 8KX14 EE 28DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F688T-ISL.pdf
(688 pages)
3.PIC16C770-ISO.pdf
(8 pages)
4.PIC16F873-04SO.pdf
(218 pages)
5.PIC16F873-04SO.pdf
(5 pages)
6.PIC16F873-04SO.pdf
(5 pages)
Specifications of PIC16F876-04/SP
Program Memory Type
FLASH
Program Memory Size
14KB (8K x 14)
Package / Case
28-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
4MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
22
Eeprom Size
256 x 8
Ram Size
368 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Data Converters
A/D 5x10b
Oscillator Type
External
Operating Temperature
0°C ~ 70°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
368 B
Interface Type
MSSP/PSP/USART
Maximum Clock Frequency
4 MHz
Number Of Programmable I/os
22
Number Of Timers
3
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 70 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163022, DV164120
Minimum Operating Temperature
0 C
On-chip Adc
5-ch x 10-bit
Package
28SPDIP
Device Core
PIC
Family Name
PIC16
Maximum Speed
4 MHz
Data Rom Size
256 B
Height
3.3 mm
Length
34.67 mm
Supply Voltage (max)
5.5 V
Supply Voltage (min)
4 V
Width
7.24 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16F876-04/SP
Manufacturer:
LT
Quantity:
8 200
9.2.18.3
Bus collision occurs during a STOP condition if:
a)
b)
FIGURE 9-25:
FIGURE 9-26:
2001 Microchip Technology Inc.
After the SDA pin has been de-asserted and
allowed to float high, SDA is sampled low after
the BRG has timed out.
After the SCL pin is de-asserted, SCL is sam-
pled low before SDA goes high.
SDA
SCL
PEN
BCLIF
P
SSPIF
SSPIF
BCLIF
SDA
PEN
SCL
Bus Collision During a STOP
Condition
P
’0’
’0’
’0’
’0’
BUS COLLISION DURING A STOP CONDITION (CASE 1)
BUS COLLISION DURING A STOP CONDITION (CASE 2)
Assert SDA
T
SDA asserted low
BRG
T
BRG
T
BRG
T
BRG
The STOP condition begins with SDA asserted low.
When SDA is sampled low, the SCL pin is allowed to
float. When the pin is sampled high (clock arbitration),
the baud rate generator is loaded with SSPADD<6:0>
and counts down to 0. After the BRG times out, SDA is
sampled. If SDA is sampled low, a bus collision has
occurred. This is due to another master attempting to
drive a data ’0’. If the SCL pin is sampled low before
SDA is allowed to float high, a bus collision occurs. This
is a case of another master attempting to drive a data
’0’ (Figure 9-25).
SCL goes low before SDA goes high,
Set BCLIF
T
BRG
T
BRG
PIC16F87X
DS30292C-page 93
’0’
’0’
SDA sampled
low after T
Set BCLIF
BRG
,