PIC16F777-I/PT Microchip Technology, PIC16F777-I/PT Datasheet - Page 260

• Manufacturer Part Number: PIC16F777-I/PT
• Description: IC PIC MCU FLASH 8KX14 44TQFP
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16F777-I/PT

• Program Memory Type: FLASH
• Program Memory Size: 14KB (8K x 14)
• Package / Case: 44-TQFP, 44-VQFP
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 36
• Ram Size: 368 x 8
• Voltage - Supply (vcc/vdd): 4 V ~ 5.5 V
• Data Converters: A/D 14x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC16F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 368 B
• Interface Type: AUSART, CCP, I2C, MSSP, SPI
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 36
• Number Of Timers: 3
• Operating Supply Voltage: 4 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: ICE2000, DM163022
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT44PT3 - SOCKET TRAN ICE 44MQFP/TQFPI3DBF777 - BOARD DAUGHTER ICEPIC3AC164305 - MODULE SKT FOR PM3 44TQFP444-1001 - DEMO BOARD FOR PICMICRO MCUAC164020 - MODULE SKT PROMATEII 44TQFP
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PIC16F7X7
44-Lead Plastic Thin Quad Flatpack (PT) 10x10x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
DS30498C-page 258
Number of Pins
Pitch
Pins per Side
Overall Height
Molded Package Thickness
Standoff §
Foot Length
Footprint (Reference)
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Pin 1 Corner Chamfer
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-026
Drawing No. C04-076
B
c
p
#leads=n1
Dimension Limits
E1
E
Units
(F)
CH
A2
E1
D1
n1
A1
A
E
D
B
n
p
L
c
n
MIN
2
1
.039
.037
.002
.018
.463
.463
.390
.390
.004
.012
.025
D1
0
5
5
L
CH x 45
INCHES
D
NOM
44
A1
.043
.039
.004
.024
.039
.472
.472
.394
.394
.006
.015
.035
.031
3.5
10
10
11
A
MAX
.047
.006
.030
.482
.482
.398
.398
.008
.017
.045
.041
15
15
7
(F)
MIN
11.75
11.75
1.00
0.95
0.05
0.45
1.00
9.90
9.90
0.09
0.30
0.64
0
5
5
MILLIMETERS*
 2004 Microchip Technology Inc.
NOM
44
12.00
12.00
10.00
10.00
0.15
0.80
1.10
1.00
0.10
0.60
0.38
0.89
3.5
10
10
11
A2
MAX
12.25
12.25
10.10
10.10
1.20
1.05
0.15
0.75
0.20
0.44
1.14
15
15
7