PIC16LF877A-I/P Microchip Technology, PIC16LF877A-I/P Datasheet - Page 213

IC MCU FLASH 8KX14 EE A/D 40DIP

PIC16LF877A-I/P

Manufacturer Part Number
PIC16LF877A-I/P
Description
IC MCU FLASH 8KX14 EE A/D 40DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets

Specifications of PIC16LF877A-I/P

Core Size
8-Bit
Program Memory Size
14KB (8K x 14)
Core Processor
PIC
Speed
10MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
33
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
368 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
40-DIP (0.600", 15.24mm)
Controller Family/series
PIC16LF
No. Of I/o's
33
Eeprom Memory Size
256Byte
Ram Memory Size
368Byte
Cpu Speed
20MHz
No. Of Timers
3
Package
40PDIP
Device Core
PIC
Family Name
PIC16
Maximum Speed
20 MHz
Operating Supply Voltage
2.5|3.3|5 V
Data Bus Width
8 Bit
Number Of Programmable I/os
33
Interface Type
I2C/SPI/USART
On-chip Adc
8-chx10-bit
Number Of Timers
3
Processor Series
PIC16LF
Core
PIC
Data Ram Size
368 B
Maximum Clock Frequency
20 MHz
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163022, DV164120
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
PIC16LF877AI/P

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC16LF877A-I/P
Manufacturer:
Microchip
Quantity:
462
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PIC16LF877A-I/PT
Manufacturer:
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Quantity:
30 000
Part Number:
PIC16LF877A-I/PT
Manufacturer:
Microchip Technology
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Part Number:
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Manufacturer:
ST
Quantity:
3 365
Part Number:
PIC16LF877A-I/PTC35
Manufacturer:
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Quantity:
46
40-Lead Plastic Dual In-line (P) – 600 mil (PDIP)
 2003 Microchip Technology Inc.
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-011
Drawing No. C04-016
n
eB
E1
E
Dimension Limits
2
1
D
§
c
Units
A2
E1
B1
eB
A1
D
p
A
E
L
B
A
n
c
A1
MIN
2.045
.160
.140
.015
.595
.530
.120
.008
.030
.014
.620
5
5
INCHES*
NOM
2.058
.100
.175
.150
.600
.545
.130
.012
.050
.018
.650
40
10
10
MAX
2.065
.190
.160
.625
.560
.135
.015
.070
.022
.680
B
B1
15
15
MIN
15.75
13.46
51.94
15.11
4.06
3.56
0.38
3.05
0.20
0.76
0.36
5
5
MILLIMETERS
PIC16F87XA
NOM
15.24
13.84
52.26
16.51
2.54
4.45
3.30
0.29
1.27
0.46
3.81
40
10
10
p
DS39582B-page 211
MAX
A2
15.88
14.22
52.45
17.27
4.83
4.06
3.43
0.38
1.78
0.56
L
15
15

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