DSPIC33FJ256GP506A-I/PT Microchip Technology, DSPIC33FJ256GP506A-I/PT Datasheet - Page 2

IC MCU 16BIT 256KB FLASH 64TQFP

DSPIC33FJ256GP506A-I/PT

Manufacturer Part Number
DSPIC33FJ256GP506A-I/PT
Description
IC MCU 16BIT 256KB FLASH 64TQFP
Manufacturer
Microchip Technology
Series
dsPIC™ 33Fr

Specifications of DSPIC33FJ256GP506A-I/PT

Program Memory Type
FLASH
Program Memory Size
256KB (256K x 8)
Package / Case
64-TFQFP
Core Processor
dsPIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
CAN, I²C, IrDA, LIN, SPI, UART/USART
Peripherals
AC'97, Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number Of I /o
53
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 18x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Product
DSCs
Data Bus Width
16 bit
Processor Series
DSPIC33F
Core
dsPIC
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
53
Data Ram Size
16 KB
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DM240001, DM240002, DM330011, DM300019, DV164033, MA330011, MA330012, DM300024
Minimum Operating Temperature
- 40 C
Package
64TQFP
Device Core
dsPIC
Family Name
dSPIC33
Maximum Speed
40 MHz
Operating Supply Voltage
3.3 V
Interface Type
CAN/I2C/SPI/UART
On-chip Adc
18-chx10-bit|18-chx12-bit
Number Of Timers
9
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DSPIC33FJ256GP506A-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
dsPIC33FJ256GPX06A/X08A/X10A
TABLE 2:
DS80483D-page 2
Note 1:
Controller
Module
ECAN
ECAN
UART
DMA
ADC
ADC
SPI
All
Only those issues indicated in the last column apply to the current silicon revision.
Consumption
Characters
CPU Write
WAKIF bit
Operation
Detection
DONE bit
Collision
Feature
in Sleep
SILICON ISSUE SUMMARY
Current
TBF bit
150ºC
Break
Mode
DMA
Number
Item
1.
2.
3.
4.
5.
6.
7.
8.
The WAKIF bit in the CxINTF register cannot be cleared by
software instruction after the device is interrupted from Sleep
due to activity on the CAN bus.
False DMA Error Traps may be generated in applications that
perform both transmissions and receptions using ECAN with
DMA.
The UART module will not generate consecutive break
characters.
The ADC Conversion Status bit (DONE) does not work when
External Interrupt is selected as the ADC trigger source.
Writing to the SPIBUF register as soon as the TBF bit is
cleared will cause the SPI module to ignore the written data.
DMA CPU write collisions will not be detected.
If the ADC module is in an enabled state when the device
enters Sleep Mode, the power-down current (I
may exceed the device data sheet specifications.
Affected revisions of silicon only support 140ºC operation
instead of 150ºC for extended operating temperature.
Issue Summary
PD
© 2010 Microchip Technology Inc.
) of the device
Revisions
A2
Affected
X
X
X
X
X
X
X
A3
X
X
X
X
X
X
X
(1)

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