PIC16F876-20I/SO Microchip Technology, PIC16F876-20I/SO Datasheet - Page 2

IC MCU FLASH 8KX14 EE 28SOIC

PIC16F876-20I/SO

Manufacturer Part Number
PIC16F876-20I/SO
Description
IC MCU FLASH 8KX14 EE 28SOIC
Manufacturer
Microchip Technology
Series
PIC® 16Fr

Specifications of PIC16F876-20I/SO

Core Size
8-Bit
Program Memory Size
14KB (8K x 14)
Core Processor
PIC
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
22
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
368 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Data Converters
A/D 5x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
28-SOIC (7.5mm Width)
Controller Family/series
PIC16F
No. Of I/o's
22
Eeprom Memory Size
256Byte
Ram Memory Size
368Byte
Cpu Speed
20MHz
No. Of Timers
3
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
368 B
Interface Type
MSSP, PSP, USART
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
22
Number Of Timers
3
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163022, DV164120
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 5 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT28SO-1 - SOCKET TRANSITION 28SOIC 300MIL309-1073 - ADAPTER 28-SOIC TO 28-SOIC309-1024 - ADAPTER 28-SOIC TO 28-DIP309-1023 - ADAPTER 28-SOIC TO 28-DIP
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC16F876-20I/SO
Manufacturer:
TEMIC
Quantity:
1 383
Part Number:
PIC16F876-20I/SO
Manufacturer:
MIC
Quantity:
20 000
PIC16F87X
2.
3.
4.
5.
TABLE 1:
DS80053B-page 2
Param
D001
A06
No.
Module: MSSP - SPI mode
The SDI pin is controlled by the module and not by
the state of the TRIS bit. This means that the SDI
pin cannot be an output when the MSSP module is
in SPI mode.
Work Around
None for current silicon revision
(fixed in silicon revision B4)
Module: Electrical Specifications
The Supply Voltage specification has not yet met
the design target (Data Sheet specification). The
specification for these devices is shown in Table 1.
Module: A/D Specifications
The Offset Error specification has not yet met the
design target (Data Sheet specification). The
specification for these devices is shown in Table 1.
Module: TMR1
When operating in external clock mode (TMR1CS
is set), reading either of the timer 1 registers
(TMR1H or TMR1L) may cause the timer not to
increment as expected. This occurs for both syn-
chronous and asynchronous inputs.
E
Sym.
V
OFF
DD
DC SPECIFICATION CHANGES FROM DATA SHEET
Characteristic
Supply Voltage
Offset Error
Min
2.5
Tested Specification
The scenarios which display this are:
a) When a read operation of the TMR1H regis-
b) When a read operation of the TMR1L regis-
Work Around
Do not read either the TMR1H or the TMR1L reg-
isters when operating in external clock mode
(TMR1CS is set). If the application needs to read
the 16-bit counter, evaluate if this function can be
moved to the TMR0 or one of the other timer
resources on the device.
Typ
ter occurs, the TMR1L register may not
increment.
ter occurs, the TMR1H register may not
increment. This improper operation is only
an issue when the TMR1L register incre-
ments from FFh to 00h (FFh
the read of the TMR1L register.
< ± 2
Max
5.5
Min
2.0
1999 Microchip Technology Inc.
Specification
Data Sheet
Typ
< ± 1
Max
00H) during
5.5
Units
LSb
V

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